High Performance Computing Technology (66 results)

- Softcover
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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- Softcover
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Language: English
Published by Springer, 2023
Series: Book 272 of 472 - SpringerBriefs in Applied Sciences and Technology
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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High Performance Computing and Communications: Advancing the Frontiers of Information Technology: Supplement to the President's FY 1997 Budget
National Science and Technology Council, Committee on Computing, Information, and Communications
Published by The White House, Washington, D.C., 1996
- Softcover
Seller: Ground Zero Books, Ltd., Silver Spring, MD, U.S.A.Ground Zero Books, Ltd.
Contact seller5-star sellerWraps. i, 57 p. Includes illustrations. Illustrations in color. Title from cover. Very good. No dust jacket as issued.

Language: English
Published by Springer, 2023
Series: Book 272 of 472 - SpringerBriefs in Applied Sciences and Technology
- Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
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- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. reprint edition. 288 pages. 9.30x6.50x0.70 inches. In Stock.

- Hardcover
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- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains the course notes of the Summerschool on High Per formance Com;~ting in Fluid Dynamics, held at the Delft University of Technology, June 24-28, 1996, under the auspices of and with support of ERCOFTAC (European Research Community on Flow, Turbulence and Combustion, WWW: and the J.M. Burgers Center (Graduate School for Fluid Dynamics, The Nether lands, WWW: In addition to the material presented in the present volume, lectures were given by J. Hauser on 'A parallel Newton-GMRES method for the 3D N avier-Stokes equations in complex geometries'. The material written down by F.-S. Lien was presented by M.A. Leschziner. This book is addressed to students on a graduate level and researchers in industry engaged in scientific computing, who have little or no experience with high performance computing, but who want to learn more, and/or want to port their code to parallel platforms. Applications in computa tional fluid dynamics are emphasized.…

- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In English.

- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Neuware - This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work was reproduced from the original artifact, and remains as true to the original work as possible. Therefore, you will see the original copyright references, library stamps (as most of these works have been housed in our most important libraries around the world), and other notations in the work. This work is in the public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work.As a reproduction of a historical artifact, this work may contain missing or blurred pages, poor pictures, errant marks, etc. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.…

- Hardcover
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- Hardcover
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Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
[ MEI ] BEI SI· KAI SE ( Beth Keser ) . [ DE ] SI DI FEN· KE LUO NA TE
- Softcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
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paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.…

- Hardcover
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Language: English
Published by Springer, 2016
Series: Book 163 of 464 - Springer Proceedings in Mathematics & Statistics
- Hardcover
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- Softcover
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- Softcover
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Language: English
Published by Springer, 2016
Series: Book 163 of 464 - Springer Proceedings in Mathematics & Statistics
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 309 pages. 9.25x6.10x1.02 inches. In Stock.

Language: English
Published by Springer, 2018
Series: Book 163 of 464 - Springer Proceedings in Mathematics & Statistics
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Language: English
Published by Springer, 2016
Series: Book 163 of 464 - Springer Proceedings in Mathematics & Statistics
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book discusses important results in modern mathematical models and high performance computing, such as applied operations research, simulation of operations, statistical modeling and applications, invisibility regions and regular meta-materials, unmanned vehicles, modern radar techniques/SAR imaging, satellite remote sensing, coding, and robotic systems. Furthermore, it is valuable as a reference work and as a basis for further study and research. All contributing authors are respected academicians, scientists and researchers from around the globe. All the papers were presented at the international conference on Modern Mathematical Methods and High Performance Computing in Science & Technology (M3HPCST 2015), held at Raj Kumar Goel Institute of Technology, Ghaziabad, India, from 27-29 December 2015, and peer-reviewed by international experts. The conference provided an exceptional platform for leading researchers, academicians, developers, engineers and technocrats from a broad range of disciplines to meet and discuss state-of-the-art mathematical methods and high performance computing in science & technology solutions. This has brought new prospects for collaboration across disciplines and ideas that facilitate novel breakthroughs.…

- Hardcover
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- Hardcover
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In English.

- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Language: English
Published by Springer, 2016
Series: Book 163 of 464 - Springer Proceedings in Mathematics & Statistics
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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- Hardcover
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- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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- Hardcover
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