Integration Vlsi Circuits (36 results)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 82.97
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- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 89.08
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Condition: New. pp. 235.
- Softcover
Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
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US$ 87.91
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 93.90
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Condition: New.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 99.50
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Condition: New.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 88.46
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- Softcover
Seller: THE SAINT BOOKSTORE, Southport, , United KingdomTHE SAINT BOOKSTORE
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US$ 91.54
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Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 91.53
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Condition: New.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 63.12
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, held in Santa Cruz, CA, USA, in October 2012. The 12 papers included in th…e book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 63.12
US$ 70.94 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, held in Santa Cruz, CA, USA, in October 2012. The 12 papers include…d in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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US$ 59.42
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Taschenbuch. Condition: Neu. VLSI-SoC: From Algorithms to Circuits and System-on-Chip Design | 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, Santa Cruz, CA, USA, October 7-10, 2012, Revised Selected Papers | Andreas Burg (u. a.) | Taschenbuch | IFIP Advances in Information and Co…mmunication Technology | x | Englisch | 2016 | Springer | EAN 9783662525296 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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US$ 142.69
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 114.22
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 114.22
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
Seller: moluna, Greven, , Germanymoluna
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US$ 92.48
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Condition: New. Katsuyuki Sakuma is a research staff member at the IBM T. J. Watson Research Center. Currently, he is also a Visiting Professor at the Department of Biomedical Engineering, Tohoku University, Japan. He has over 19 years of experience of .
- Softcover
Seller: Revaluation Books, Exeter, , United KingdomRevaluation Books
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US$ 137.69
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Paperback. Condition: Brand New. 233 pages. 9.21x6.14x0.47 inches. In Stock.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 141.41
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paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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US$ 171.80
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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US$ 171.80
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 112.50
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Taschenbuch. Condition: Neu. Neuware - The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package…(SiP), 3D heterogeneous integration, and monolithic 3D I.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 200.96
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Condition: Used. pp. 233.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 204.58
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Condition: New.
- Hardcover
Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
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US$ 206.94
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Condition: Used. pp. 233.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 205.31
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Condition: New.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 194.44
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Hardcover. Condition: New. New. book.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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US$ 220.02
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Condition: Used. pp. 233.
- Hardcover
Seller: Chiron Media, Wallingford, , United KingdomChiron Media
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US$ 212.54
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Hardcover. Condition: New.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 233.16
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 238.91
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: moluna, Greven, , Germanymoluna
Contact seller5-star sellerCondition: New
US$ 241.46
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Condition: New. Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and mono.
