Microelectromechanical Systems Devices (87 results)

Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.

Condition: New.

Condition: New.

Paperback. Condition: New. Microelectromechanical systems (MEMS) hold great promise for sensing and actuating on the micron scale. There is a hierarchy of increasing difficulty for placing MEMS devices in the field. Devices that do not allow contact between structural members rely mainly on mechanical properties of freestanding films. High-resolution techniques must be developed within the framework of MEMS to measure properties such as modulus and residual stress. When contact and rubbing contact are allowed, the complexities of adhesion and friction at the microscale must be understood and well controlled. Fluid interactions are similarly important for microfluidic devices. Packaging of MEMS for use in the field also requires special consideration, because it is often application specific. This book investigates various materials, characterization methods and processing techniques. These approaches represent different but useful strategies to solve MEMS challenges, and must be integrated for product realization. Topics include: deposition and characterization of Si; materials and processes for MEMS; tribology; dynamic optical characterization; packaging; LIGA; materials aspects; and characterization of MEMS processing.…

Condition: New. In English.

Paperback. Condition: New.

Paperback. Condition: New.

Condition: New.

Condition: New.

Condition: New. pp. 480.

Condition: New. In English.

Condition: New. pp. 480.

Condition: New. pp. 334.

Condition: New. pp. 480.

Condition: New.

Condition: New.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Symposium S, 'Microelectromechanical Systems - Materials and Devices IV', held November 29-December 3 at the 2010 MRS Fall Meeting in Boston, Massachusetts, focused on micro- and nanoelectromechanical systems (MEMS/NEMS), technologies which were spawned from the fabrication and integration of small-scale mechanical, electrical, thermal, magnetic, fluidic and optical sensors and actuators with micro-electronic components. MEMS and NEMS have enabled performance enhancements and manufacturing cost reductions in a number of applications, including optical displays, acceleration sensing, radio-frequency switching, drug delivery, chemical detection and power generation and storage. Although originally based on silicon microelectronics, the reach of MEMS and NEMS has extended well beyond traditional engineering materials and now includes nanomaterials (nanotubes, nanowires, nanoparticles), smart materials (piezoelectric and ferroelectric materials, shape memory alloys, pH-sensitive polymers), metamaterials and biomaterials (ceramic, metallic, polymeric, composite-based implant materials). While these new materials provide more freedom with regards to the design space of MEMS and NEMS, they also introduce a number of new fabrication and characterization challenges not previously encountered with silicon-based technology.…

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectromechanical systems (MEMS) hold great promise for sensing and actuating on the micron scale. There is a hierarchy of increasing difficulty for placing MEMS devices in the field. Devices that do not allow contact between structural members rely mainly on mechanical properties of freestanding films. High-resolution techniques must be developed within the framework of MEMS to measure properties such as modulus and residual stress. When contact and rubbing contact are allowed, the complexities of adhesion and friction at the microscale must be understood and well controlled. Fluid interactions are similarly important for microfluidic devices. Packaging of MEMS for use in the field also requires special consideration, because it is often application specific. This book investigates various materials, characterization methods and processing techniques. These approaches represent different but useful strategies to solve MEMS challenges, and must be integrated for product realization. Topics include: deposition and characterization of Si; materials and processes for MEMS; tribology; dynamic optical characterization; packaging; LIGA; materials aspects; and characterization of MEMS processing.…

Condition: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Paperback. Condition: New. Microelectromechanical systems (MEMS) hold great promise for sensing and actuating on the micron scale. There is a hierarchy of increasing difficulty for placing MEMS devices in the field. Devices that do not allow contact between structural members rely mainly on mechanical properties of freestanding films. High-resolution techniques must be developed within the framework of MEMS to measure properties such as modulus and residual stress. When contact and rubbing contact are allowed, the complexities of adhesion and friction at the microscale must be understood and well controlled. Fluid interactions are similarly important for microfluidic devices. Packaging of MEMS for use in the field also requires special consideration, because it is often application specific. This book investigates various materials, characterization methods and processing techniques. These approaches represent different but useful strategies to solve MEMS challenges, and must be integrated for product realization. Topics include: deposition and characterization of Si; materials and processes for MEMS; tribology; dynamic optical characterization; packaging; LIGA; materials aspects; and characterization of MEMS processing.…

Condition: New.

Hardback. Condition: New.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.