Microelectronic Packaging Architectures Applications (17 results)
Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
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Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
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Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
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Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Language: English
Published by Springer 2021
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. 3D Microelectronic Packaging | From Architectures to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | xvii | Englisch | 2021 | Springer | EAN 9789811570926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juerg…en[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer 2021
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. 2nd ed. 2021 edition NO-PA16APR2015-KAP.
Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Hardcover. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer, Springer 2021
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides reade…rs an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Language: English
Published by Springer, Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an i…n-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Language: English
Published by Springer Nature 2021
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Revaluation Books, Exeter, , United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 2nd edition. 639 pages. 9.25x6.10x1.50 inches. In Stock.
Language: English
Published by Springer Singapore 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
- Print on Demand
Seller: moluna, Greven, , Germanymoluna
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides comprehensive coverage of 3D microelectronic packages Explains the fundamentals of using solder interconnects as micro-bumps Demonstrates the advanced materials and processes used in 3D microelectro…nic packages Introd.
Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
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Condition: New. Print on Demand This item is printed on demand.
Language: English
Published by Springer 2021
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
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Condition: New. Print on Demand.
Language: English
Published by Springer 2020
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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US$ 320.81
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Condition: New. PRINT ON DEMAND.
Language: English
Published by Springer 2021
Series: Springer Series in Advanced Microelectronics, Book 66. Book 66 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. PRINT ON DEMAND.
