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Microelectronics Packaging Handbook Subsystem by Tummala R R (12 results)
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hardcover. Condition: Very Good. 2nd. Used - Very Good.
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US$ 38.01
Convert currencyUS$ 17.26 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515.
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US$ 38.46
Convert currencyUS$ 17.26 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Condition: New.
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US$ 179.25
Convert currencyUS$ 3.99 shipping within U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 191.23
Convert currencyUS$ 15.98 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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US$ 213.97
Convert currencyUS$ 57.13 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketGebunden. Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
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US$ 300.81
Convert currencyUS$ 33.34 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: Like New. Like New. book.
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Condition: As New. Unread book in perfect condition.
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Microelectronics Packaging Handbook : Subsystem Packaging Part III
Published by Springer Us Jan 1997, 1997
ISBN 10: 0412084511 ISBN 13: 9780412084515
Language: English
US$ 297.82
Convert currencyUS$ 75.77 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketBuch. Condition: Neu. Neuware - This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables.Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development.Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail.Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
