Technology Cad Systems (25 results)
Language: English
Published by Chapman & Hall, 1995
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: Anybook.com, Lincoln, United KingdomAnybook.com
Contact seller5-star sellerCondition: Used - Fair
US$ 3.45
US$ 18.20 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,600grams, ISBN:9780412617300.
Language: English
Published by Springer, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United KingdomPhatpocket Limited
Contact seller5-star sellerCondition: Used - Good
US$ 40.97
US$ 14.23 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 70.00
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Condition: New. In.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 89.65
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 324.
Language: English
Published by Springer Vienna, 2013
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 92.15
US$ 16.72 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Language: English
Published by Springer Vienna, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: moluna, Greven, Germanymoluna
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US$ 56.81
US$ 55.86 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New.
More imagesLanguage: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 59.19
US$ 79.82 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 70.43
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's bus…iness. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
- Hardcover
Seller: -OnTimeBooks-, Phoenix, AZ, U.S.A.-OnTimeBooks-
Contact seller5-star sellerCondition: Used - Very good
US$ 151.95
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Sh…ips USPS Media Mail.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 128.15
US$ 33.45 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - Very good
US$ 192.92
US$ 33.45 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. Dust Jacket may NOT BE INCLUDED.CDs may be missing. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by New York, NY, U.S.A.: Chapman & Hall, 1995, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: White Raven Books, Ypsilanti, MI, U.S.A.White Raven Books
Contact seller5-star sellerCondition: Used - Near fine
US$ 225.00
US$ 15.00 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Near Fine. 6"x9.5". Shiny yellow paper over boards; an almost fine ex library copy with no dust jacket; "This book presents a state-of-the-art review of feature techniques in CAD/CAM.The key feature modelling issues addressed are: organization, management, representation, recognition, and validation.".
Language: English
Published by Springer, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 260.50
US$ 16.03 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Language: English
Published by Springer, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 266.54
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 260.48
US$ 20.07 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by Springer, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 274.96
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by Springer, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 279.71
US$ 20.07 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer Us Dez 1994, 1994
Series: IFIP Advances in Information and Communication Technology, Book 1 of 292. Book 1 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 356.63
US$ 71.87 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Neuware - This book provides up-to-date information about the promising use of feature technology for integrating computer-aided-design with subsequent applications. The book consists of 20 articles based upon the international IFIP conference on this topic held in Valenciennes, France in May 1994.
- Hardcover
Seller: Celler Versandantiquariat, Eicklingen, GermanyCeller Versandantiquariat
Contact seller5-star sellerAssociation member: GIAQ
Condition: Used
US$ 31.71
US$ 43.33 shippingShips from Germany to U.S.A.Quantity: 1 available
Add to basketSpringer, Wien, 1993. VIII, 309 pages with 199 figures, hard cover, (former library book)--- 736 Gramm.
Language: Chinese
Published by Northwestern Polytechnical University Press, 2000
- Softcover
Seller: liu xing, Nanjing, JS, Chinaliu xing
Contact seller5-star sellerCondition: New
US$ 73.67
US$ 18.00 shippingShips from China to U.S.A.Quantity: 1 available
paperback. Condition: New. Paperback. Pub Date: 2011 Pages: 337 Language: Chinese in Publisher: Northwestern Polytechnical University Press colleges 12th Five-Year Plan textbook Mechanical Manufacturing and Automation Series: CAD facing the entire product lifecycle theory and technology system from the point of view for the enti…re life cycle of products. a combination of theory and practice. the system is a thorough introduction to the basic concepts of a CAD development history. theory. techniques. methods. systems. a.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 54.29
US$ 7.75 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer Vienna Jan 2012, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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US$ 62.81
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compet…e in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. 324 pp. Englisch.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 89.74
US$ 8.70 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand pp. 324 199 Figures, 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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US$ 95.03
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Condition: New. PRINT ON DEMAND pp. 324.
Language: English
Published by Springer Vienna, Springer Jan 2012, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
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US$ 62.81
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in… today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 324 pp. Englisch.
