Wafer Scale Integration (43 results)
- Hardcover
Seller: Crossroad Books, Eau Claire, WI, U.S.A.Crossroad Books
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Hardcover. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight spine twist. Pages clean, but for library markings. ; TEH22A; 274 pages; Ex-Library.
- Hardcover
Seller: Anybook.com, Lincoln, United KingdomAnybook.com
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Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,700grams, ISBN:0852744978.
- Hardcover
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.Zubal-Books, Since 1961
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Condition: Good. 402 pp., hardcover, ex library, else text clean & binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
- Hardcover
Seller: Better World Books, Mishawaka, IN, U.S.A.Better World Books
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US$ 221.77
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Condition: Good. 1989th Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
- Softcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
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US$ 221.32
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Condition: Muy bueno. : Wafer Scale Integration es un libro editado por Earl E. Swartzlander, publicado en 1989 por Springer US. El libro aborda temas de ingeniería de sistemas, ingeniería informática y ciencia de la computación. Cuenta con 528 páginas y está disponible en formato electrónico y en versión impresa. El texto compl…eto en línea está restringido a suscriptores. EAN: 9781461288961 Tipo: Libros Categoría: Tecnología|Ciencias Título: Wafer Scale Integration Autor: Earl E. Swartzlander Idioma: en Páginas: 528.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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US$ 212.21
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hardcover. Condition: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 260.00
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Condition: New.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 260.50
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Condition: New. In.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 260.50
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Condition: New. In.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 260.48
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Condition: New.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 274.96
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Condition: New.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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US$ 306.49
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Condition: New. Editor(s): Swartzlander, Earl E. Num Pages: 503 pages, black & white illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 28. Weight in Grams: 912. . 1989. Hardback. . . . .
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 315.82
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Condition: New. pp. 528.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 316.16
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Condition: New. pp. 528.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 262.02
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dic…e. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 264.28
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In c…ontrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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US$ 367.68
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Condition: New. Editor(s): Swartzlander, Earl E. Num Pages: 503 pages, black & white illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 28. Weight in Grams: 912. . 1989. Hardback. . . . . Books ship from the US and Ireland.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 378.94
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Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 383.09
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 396.87
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 413.89
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Condition: As New. Unread book in perfect condition.
1991 Proceedings International Conference on Wafer Scale Integration: January 29-31, 1991 San Francisco, California, USA (International Conference on Wafer Scale Integration Proceedings)
International Conference on Wafer Scale Integration (3rd : 1991 : San Francisco, Calif.)
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 810.27
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hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: Celler Versandantiquariat, Eicklingen, GermanyCeller Versandantiquariat
Contact seller5-star sellerAssociation member: GIAQ
Condition: Used
US$ 19.97
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Add to basketHilger, Bristol, 1986. XII, 274 pages with some graphics, hardcover in dust jacket----former library book in good condition/ Proceedings of a Workshop held in Southampton from 10 july to 12 july 1985- 618 Gramm.
Published by Der Andere Verlag, 2014
- Softcover
Seller: Buchpark, Trebbin, GermanyBuchpark
Contact seller5-star sellerCondition: Used - Fine
US$ 143.95
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Condition: Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.
Seller: Martinton Book Company, martinton, IL, U.S.A.Martinton Book Company
Contact seller5-star sellerIEEE l99l 340pp. (ISBN 0-8l86-9126-3).
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 39.93
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-scale integration, WSI for short, is a yet-unused system of building very-large integrated circuit… networks that use an entire silicon wafer to produce a single 'super-chip'. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term very-large-scale integration, the current state of the art when WSI was being developed. 80 pp. Englisch.
- Softcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 42.15
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-scale integration, WSI for short, is a yet-unused system of building very-large integrated circuit netw…orks that use an entire silicon wafer to produce a single 'super-chip'. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term very-large-scale integration, the current state of the art when WSI was being developed.
- Softcover
- Print on Demand
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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US$ 196.88
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Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
- Hardcover
- Print on Demand
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 196.88
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Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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US$ 195.30
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Condition: new. Questo è un articolo print on demand.
