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The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.
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About the Author:
Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
"About this title" may belong to another edition of this title.
- PublisherSpringer
- Publication date1998
- ISBN 10 0412085615
- ISBN 13 9780412085611
- BindingCD-ROM
- Edition number2
- Number of pages1000
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Book Description Compact Disc. Condition: new. Compact Disc. Providing recent advances in microelectronics design methods, modelling tools, simulation techniques and manufacturing processes, this work discusses packages that meet the power, cooling, protection and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information. The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. Seller Inventory # 9780412085611
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