Test Procedures for Developing Solder Data: Nemi Task Group on Lead-Free Alloys and Reliability (Classic Reprint) - Hardcover

T. E. Siewert

9780265841983: Test Procedures for Developing Solder Data: Nemi Task Group on Lead-Free Alloys and Reliability (Classic Reprint)

Hardcover

ISBN 10: 0265841984 ISBN 13: 9780265841983

Publisher: Forgotten Books, 2018

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A practical, standardized guide for testing solder data you can trust.

This reference compiles procedures for measuring the mechanical properties of lead-free solders and their joints. It focuses on repeatable methods that support high-volume, automated electronics assembly and easy comparison across laboratories. The book helps you plan, record, and interpret tests so you can build reliable data for design and process control.

Structured for practical use, it covers a wide range of tests—from thermal analysis to intermetallic growth, fracture toughness, and thermomechanical fatigue. Whether you’re setting up new tests or refining existing ones, this edition provides the workflows and reporting approaches needed to create a useful solder data database.

Thermal analysis methods and evaluation of melting/solidification behavior
Wetting balance testing to compare solder-assembly interfaces
Tensile and joint-formation procedures for representative test specimens
Techniques for measuring intermetallic compound growth, fracture toughness, and long-term reliability under thermal cycling

Ideal for engineers and technicians working with lead-free solders and the data that drive design and manufacturing decisions.

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