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Synopsis
Excerpt from Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices<br/><br/>Of the several hundred sem photographs made, the examples shown were selected to be indicative of particular faults. It is not intended to suggest that the faults illustrated are unique to a particular device type, production line, or circuit configuration. In fact, most of the faults were observed to some extent in all types of the devices investi gated.
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Scanning Electron Microscope Examination of Wire Bonds From High-Reliability
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Paperback. Condition: New. Print on Demand. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item. Seller Inventory # 9780364024744_0
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Scanning Electron Microscope Examination of Wire Bonds From HighReliability Devices Nbs Technical Note 785 Classic Reprint
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Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices
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Condition: Like New. In unused condition, may show some slight shelf wear, but otherwise unread. This title was digitally scanned from a rare, out of print edition, and will have some visual artifacts from that process. Seller Inventory # #267F-0007
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Scanning Electron Microscope Examination of Wire Bonds From HighReliability Devices Nbs Technical Note 785 Classic Reprint
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PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000. Seller Inventory # LW-9780364024744
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