Synopsis
Excerpt from Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices<br/><br/>Of the several hundred sem photographs made, the examples shown were selected to be indicative of particular faults. It is not intended to suggest that the faults illustrated are unique to a particular device type, production line, or circuit configuration. In fact, most of the faults were observed to some extent in all types of the devices investi gated.
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Scanning Electron Microscope Examination of Wire Bonds From High-Reliability
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