Items related to Surface Mount Technology: Principles and Practice
Synopsis
Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.
"synopsis" may belong to another edition of this title.
Other Popular Editions of the Same Title
Search results for Surface Mount Technology: Principles and Practice
Seller Image
Surface Mount Technology: Principles and Practice (Paperback or Softback)
Published by
Springer 3/7/2012, 2012
ISBN 10: 9401165343
ISBN 13: 9789401165341
New
Paperback or Softback
Seller: BargainBookStores, Grand Rapids, MI, U.S.A.
Seller rating 5 out of 5 stars
Paperback or Softback. Condition: New. Surface Mount Technology: Principles and Practice 1.86. Book. Seller Inventory # BBS-9789401165341
Quantity: 5 available
Stock Image
Surface Mount Technology: Principles and Practice
Seller: Best Price, Torrance, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: New. SUPER FAST SHIPPING. Seller Inventory # 9789401165341
Quantity: 2 available
Stock Image
Surface Mount Technology: Principles and Practice
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
Condition: New. Seller Inventory # ABLIING23Apr0412070058658
Quantity: Over 20 available
Stock Image
Surface Mount Technology: Principles and Practice
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In. Seller Inventory # ria9789401165341_new
Quantity: Over 20 available
Stock Image
Surface Mount Technology: Principles and Practice
Seller: Chiron Media, Wallingford, United Kingdom
Seller rating 4 out of 5 stars
Paperback. Condition: New. Seller Inventory # 6666-IUK-9789401165341
Quantity: 10 available
Seller Image
Surface Mount Technology
Published by
Springer Netherlands Mrz 2012, 2012
ISBN 10: 9401165343
ISBN 13: 9789401165341
New
Taschenbuch
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology. 640 pp. Englisch. Seller Inventory # 9789401165341
Quantity: 2 available
Stock Image
Surface Mount Technology
Seller: Books Puddle, New York, NY, U.S.A.
Seller rating 4 out of 5 stars
Condition: New. pp. 642. Seller Inventory # 26128250596
Quantity: 4 available
Stock Image
Surface Mount Technology
Print on DemandSeller: Majestic Books, Hounslow, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. Print on Demand pp. 642 23:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on White w/Gloss Lam. Seller Inventory # 131288379
Quantity: 4 available
Stock Image
Surface Mount Technology
Print on DemandSeller: Biblios, Frankfurt am main, HESSE, Germany
Seller rating 5 out of 5 stars
Condition: New. PRINT ON DEMAND pp. 642. Seller Inventory # 18128250606
Quantity: 4 available
Seller Image
Surface Mount Technology
Published by
Springer Netherlands, Springer Netherlands Mär 2012, 2012
ISBN 10: 9401165343
ISBN 13: 9789401165341
New
Taschenbuch
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. Neuware -Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 640 pp. Englisch. Seller Inventory # 9789401165341
Quantity: 2 available