Bhatt G S (24 results)

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  • Language: English

    Published by Rawat Publications, 2010

    8131603296 / 9788131603291

    • Hardcover

    Seller: Better World Books: West, Reno, NV, U.S.A.Better World Books: West

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    Condition: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

  • Language: English

    Published by Cbs

    8187540133 / 9788187540137

    • Softcover

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    Condition: Good. [ No Hassle 30 Day Returns ][ Ships Daily ] [ Underlining/Highlighting: NONE ] [ Writing: SOME ] [ Edition: Sixth ] Publisher: The National Book Depot Date: 1/1/2002 Binding: Paperback Pages: 128 Sixth edition.

  • Language: English

    Published by Motilal Banarsidass Publishers Pvt. Ltd., 2004

    8120803620 / 9788120803626

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    Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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    Condition: New. pp. xiv + 355-738.

  • Condition: New

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    Condition: New. pp. 247.

  • Language: English

    Published by Motilal Banarsidass Publishers Pvt. Ltd. MLBD, 2004

    8120803620 / 9788120803626

    • Hardcover

    Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle

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    Condition: New. pp. xiv + 355-738 Index.

  • Language: English

    Published by Motilal Banarsidass Publishers Pvt. Ltd., 2017

    8120803612 / 9788120803619

    • Hardcover

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    Condition: New. pp. xxix + 354.

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    Condition: New. pp. 247.

  • Condition: New

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    Condition: New. pp. 247.

  • Language: English

    Published by Motilal Banarsidass Publishers Pvt. Ltd. MLBD, 2017

    8120803612 / 9788120803619

    • Hardcover

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    Condition: New. pp. xxix + 354 Index.

  • Published by Jawahar Publishers & Distributors

    8173610886 / 9788173610882

    Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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    Condition: New. pp. iv + 188.

  • Published by Bharatiya Book Corporation

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    Condition: New.

  • Language: English

    Published by Rawat Publication, Jaipur, 2010

    8131603296 / 9788131603291

    • Hardcover

    Seller: Books in my Basket, New Delhi, IndiaBooks in my Basket

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    Hardcover. Condition: New. ISBN:8131603296,432pp.

  • Language: English

    Published by Rawat, 2010

    8131603296 / 9788131603291

    • Hardcover

    Seller: Vedams eBooks (P) Ltd, New Delhi, IndiaVedams eBooks (P) Ltd

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    Hardcover. Condition: New. Contents Preface In memoriam Acknowledgements 1 Prelude 2 Concepts and explanations 3 Mahasu Desh land and people 4 Social structural setting 5 Mahasu Katha 6 Mahasu Devta 7 Mahasu Puja 8 Other dimensions of Mahasu Puja 9 Managing the cult 10 Cult religion and society Bibliography Index This anthropological study is an outcome of the authors lifelong involvement with the people and culture of Rawain Jaunpur It started as a fallout of a study on polyandry in this area But it assumed multi dimensionality with deeper probing The book not only studies the phenomenon of Mahasu from sociological perspective but also beautifully highlights the life of the ordinary man of the region as it is woven in and around their Devta the Mahasu The book brings out the continuity and deep rootedness of Indian cultural stream It highlights the linkage between the local beliefs and practices with the Sanskritic tradition of the great Indian culture The book leans heavily on the attempts made by Indians to understand or explain themselves their heritage and identity through the concept of unity in diversity underlying the main idea that unity is attitudinal but diversity is real Thus the book provides a seasoned reorientation to many methodological issues associated with sociology of religion The book is a masterpiece in terms of methodology and theoretical acumen It knits up various theoretical perspectives into one stream of understanding through language culture perspective It is an exemplary academic gift for generations to come by an octogenarian trained in the traditions of pure anthropological methods of data collection 420 pp.…

  • Language: English

    Published by Motilal Banarsidass, 2017

    8120803612 / 9788120803619

    • Hardcover

    Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd

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    Condition: New. New. In shrink wrap. Looks like an interesting title! 1.34.

  • Language: English

    Published by VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2013

    3659472808 / 9783659472800

    • Softcover

    Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle

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    Condition: New. pp. 188.

  • Language: English

    Published by LAP LAMBERT Academic Publishing, 2013

    3659472808 / 9783659472800

    • Softcover

    Seller: preigu, Osnabrück, Germanypreigu

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    Taschenbuch. Condition: Neu. Heat Transfer Augmentation in a Semiconductor Device | G. S. Bhatt | Taschenbuch | 188 S. | Englisch | 2013 | LAP LAMBERT Academic Publishing | EAN 9783659472800 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. …

  • Language: English

    Published by LAP LAMBERT Academic Publishing, 2013

    3659472808 / 9783659472800

    • Softcover

    Seller: Mispah books, Redhill, SURRE, United KingdomMispah books

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    Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

  • Condition: Used - Good

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    Condition: Good. Very light shelf wear, boards have been plastic covered, with glue marks inside coveres where it has been stuck. Very small tear on flysheet. Contents pages have small creases and light mark at top. Rest of contents clean.

  • Language: English

    Published by LAP LAMBERT Academic Publishing Okt 2013, 2013

    3659472808 / 9783659472800

    • Softcover
    • Print on Demand

    Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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    Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10 C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer. 188 pp. Englisch.…

  • Language: English

    Published by LAP LAMBERT Academic Publishing, 2013

    3659472808 / 9783659472800

    • Softcover
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    Seller: moluna, Greven, Germanymoluna

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    Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Bhatt G. S.Dr. Bhatt has served some reputed engineering colleges in Bangalore, India, as a faculty over fifteen years. Dr. Bhatt has conducted a few training programs for the engineering faculty. He has published many research paper.…

  • Language: English

    Published by LAP LAMBERT Academic Publishing, 2013

    3659472808 / 9783659472800

    • Softcover
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    Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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    Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10 C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.…

  • Language: English

    Published by VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2013

    3659472808 / 9783659472800

    • Softcover
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    Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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    Condition: New. Print on Demand pp. 188 2:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on Creme w/Gloss Lam.

  • Language: English

    Published by VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2013

    3659472808 / 9783659472800

    • Softcover
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    Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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    Condition: New. PRINT ON DEMAND pp. 188.

  • Language: English

    Published by LAP LAMBERT Academic Publishing Okt 2013, 2013

    3659472808 / 9783659472800

    • Softcover
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    Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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    Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10¿C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 188 pp. Englisch.…