Gösele U (21 results)
- Hardcover
- First Edition
Seller: Antiquariat Bader Tübingen, Tübingen, GermanyAntiquariat Bader Tübingen
Contact seller4-star sellerCondition: Used
US$ 11.54
US$ 24.64 shippingShips from Germany to U.S.A.Quantity: 1 available
1. Aufl. XII, 267 Seiten. Gr.-8vo. Leinen mit Schutzumschlag. Schutzumschlag etwas gerbäunt. Sehr ordentliches Exemplar. 9783163384620 Sprache: Deutsch Gewicht in Gramm: 600.
- Hardcover
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, GermanyAntiquariat Thomas Haker GmbH & Co. KG
Contact seller5-star sellerAssociation member: GIAQ
Condition: Used - Very good
US$ 58.84
US$ 28.00 shippingShips from Germany to U.S.A.Quantity: 1 available
Hardcover. Condition: Gut. 294, 256 p., with numerous figures, 29 cm, Good condition. Ex-Library with usual markings. Sprache: Englisch Gewicht in Gramm: 1960.
- Hardcover
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, GermanyAntiquariat Thomas Haker GmbH & Co. KG
Contact seller5-star sellerAssociation member: GIAQ
Condition: Used - Very good
US$ 29.54
US$ 28.00 shippingShips from Germany to U.S.A.Quantity: 1 available
Hardcover/Pappeinband. Condition: Gut. 312 Seiten mit Ill. und graph. Darst.; 31 cm. Noch guter Zustand. Bibliotheksexemplar mit Stempeln und Signatur auf Einband. Einband berieben. Sonst Seiten sauber. / Good. Ex-library with usual markings. Clean pages. Sprache: Deutsch Gewicht in Gramm: 1600.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 203.37
US$ 19.85 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 214.76
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 210.76
US$ 19.85 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller5-star sellerCondition: New
US$ 225.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, GermanyBUCHSERVICE / ANTIQUARIAT Lars Lutzer
Contact seller5-star sellerCondition: Used - Very good
US$ 219.11
US$ 44.75 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: gut. 1996. C, H, N and O in Si and Characterization and Simulation of Materials and Processes. Part I and II. (European Materials Research Society Symposia Proceedings, Vol. 56). In englischer Sprache. pages.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 253.24
US$ 14.94 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.
- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
Contact seller5-star sellerCondition: New
US$ 274.57
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Hardback. Condition: New. A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.…
Semiconductor Wafer Bonding Science and Technology
Tong, Q. Y./ Gosele, U./ Electrochemical Society (Corporate Author)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 284.68
US$ 16.54 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 1st edition. 297 pages. 9.75x6.50x0.75 inches. In Stock.
- Hardcover
Seller: Vulkaneifel Bücher, Birgel, GermanyVulkaneifel Bücher
Contact seller5-star sellerCondition: Used - As new
US$ 168.40
US$ 139.35 shippingShips from Germany to U.S.A.Quantity: 2 available
hardcover. Condition: Wie neu. minimale Lagerspuren am Buch, Inhalt einwandfrei und ungelesen Sprache: Englisch Gewicht in Gramm: 635.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 305.10
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
Contact seller5-star sellerCondition: New
US$ 277.05
US$ 86.02 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Hardback. Condition: New. A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more. This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others. For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.…
Language: English
Published by Springer, 2004
Series: Book 62 of 233 - Springer Series in Materials Science
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 411.94
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
Language: English
Published by Springer, 2004
Series: Book 62 of 233 - Springer Series in Materials Science
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 464.20
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer Verlag, 2004
Series: Book 62 of 233 - Springer Series in Materials Science
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 603.61
US$ 16.54 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 1st edition. 499 pages. 9.25x6.25x0.75 inches. In Stock.
- Hardcover
Seller: Studibuch, Stuttgart, GermanyStudibuch
Contact seller5-star sellerCondition: Used - Very good
US$ 20.01
US$ 69.79 shippingShips from Germany to U.S.A.Quantity: 1 available
hardcover. Condition: Gut. 315 Seiten; 9783481003975.3 Gewicht in Gramm: 2.
Language: German
Published by München, Institut für internationale Architektur-Dokumentation,, 1986
- Hardcover
Seller: Göppinger Antiquariat, Göppingen, GermanyGöppinger Antiquariat
Contact seller5-star sellerCondition: Used
US$ 48.46
US$ 56.01 shippingShips from Germany to U.S.A.Quantity: 1 available
Add to basket30 x 24 cm, Leinen mit OSchU. Zweite Auflage. 319 S. mit zahlr. Ill. Schutzumschlag berieben und mit Einrissen. Sprache: Deutsch Gewicht in Gramm: 1100.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 28.85
US$ 78.41 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Umweltethik | Eine Einführung in globaler Perspektive | Michael/Gösele, Andreas/Köhler, Lukas u a Reder | Taschenbuch | 156 S. | Deutsch | 2019 | Kohlhammer | EAN 9783170314672 | Verantwortliche Person für die EU: W. Kohlhammer GmbH, Heßbrühlstr. 69, 70565 Stuttgart, produktsicherheit[at]kohlhammer[dot]de | Anbieter: preigu. …
Language: English
Published by Springer Berlin Heidelberg, 2004
Series: Book 62 of 233 - Springer Series in Materials Science
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 359.71
US$ 54.88 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingPresents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingInclu.…
