Martin Grill (53 results)
Published by Verlag " Die Brücke " , München 1969, 1969
- Softcover
Seller: Antiquariat Bücherparadies, Landsberg, GermanyAntiquariat Bücherparadies
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Add to basketKart., guter Zustand , 64 S.
Language: German
Published by Verlag die Brücke 1969,., 1969
- Softcover
Seller: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Germanybooks4less (Versandantiquariat Petra Gros GmbH & Co. KG)
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Add to basketTaschenbuch. Condition: Gut. 64 Seiten, Papierqualität und Alter führten zu einer Nachdunklung der Seiten und der Buchschnitt ist angebräunt. Im übrigen ist das Tashenbuch in einem guten Zustand. Sprache: Deutsch Gewicht in Gramm: 80.
Böhmische Reise, besinnliche und beschauliche Verse am Wegrand geschrieben
Seliger - Gemeinde Gesinnungsgemeinschaft sudetendeutscher Sozialdemokraten / Martin Grill
Published by Verlag "Die Brücke ", München 1969, 1969
- Softcover
Seller: Antiquariat Bücherparadies, Landsberg, GermanyAntiquariat Bücherparadies
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Add to basketkart. 64 S. guter Zustand.
Language: German
Published by Seliger-Archiv - Verl. Die Brücke, 1980
Seller: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Germanybooks4less (Versandantiquariat Petra Gros GmbH & Co. KG)
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Add to basketgebundene Ausgabe. Condition: Gut. 143 Seiten; Das Buch befindet sich in einem gut erhaltenen Zustand. Sprache: Deutsch Gewicht in Gramm: 320.
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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Language: German
Published by rororo
- Softcover
Seller: KULTur-Antiquariat, Boizenburg, MV, GermanyKULTur-Antiquariat
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Add to basketTaschenbuch. Condition: Gut. Gut bis sehr gut erhalten, Schnitt überwiegend angeblichen. Rotfuchs-Nrn: 391, 344, 20548, 251, 645, 639, 687, 20803. Der Versand ins Ausland ist gegen Zahlung der Portokosten möglich. Bitte nehmen Sie Kontakt mit uns auf. Sprache: Deutsch Gewicht in Gramm: 950.
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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Paperback. Condition: New.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In English.
- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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Condition: New.
- Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
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Condition: New. pp. 204.
- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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Condition: New.
More imagesPublished by Selbstverlag, 1980
Seller: biblion2, Obersulm, Germanybiblion2
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Add to basketCondition: very good. Gebunden. Sofortversand aus Deutschland. Artikel wiegt maximal 500g. 143 Seiten. ohne SU, wenige Seiten gering verfärbt, Einband leicht stockfleckig, gering verformtes Exemplar.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.…
More imagesPublished by Die Brücke, München im Auftrage der Seliger-Gemeinde, 1960
Seller: biblion2, Obersulm, Germanybiblion2
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Add to basketCondition: very good. Gebunden. Sofortversand aus Deutschland. Artikel wiegt maximal 500g. Buch ohne Jahresangabe. Angegebenes Erscheinungsdatum ist geschätzt. 80 Seiten. Einband mit leichten Gebrauchsspuren. Einband lichtverfärbt und verfärbt. Vor- und Nachsatz leicht verfärbt. Seiten in gutem Zustand und ohne Anmerkungen. Erscheinungsjahr ca. 1960.…
More imagesPublished by Verlag, 1969
Seller: biblion2, Obersulm, Germanybiblion2
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Add to basketCondition: very good. Broschiert. Sofortversand aus Deutschland. Artikel wiegt maximal 500g. Vorsatz mit Stempel. Schnitt verfärbt. Schutzumschlag. 64 Seiten. Einband leicht bestoßen und berieben.
- Hardcover
Seller: Paradou Books, Richmond, VA, U.S.A.Paradou Books
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Hardcover. Condition: Fine. Hardcover, 144 pgs. Text in English & German. Fine. The Beninese assemblage virtuoso Romuald Hazoumè (born 1962) transforms plastic jugs and other discarded materials into masks and sculptural installations that explore the nexus of ritual and industrialization. Hazoumè mines the space of economic and psychic transaction between Africa and Europe--both the literal exchange of goods and the mutual delusion that paradise lies within the other.…
Published by München, Die Brücke, 1969
- Softcover
Seller: Antiquariat Klaus Altschäfl, Pfarrkirchen, GermanyAntiquariat Klaus Altschäfl
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Add to basket64 S. Orig.Broschur Sehr gut erhalten.
Published by Stuttgart, Seliger-Archiv, 1980
- Hardcover
Seller: Antiquariat Klaus Altschäfl, Pfarrkirchen, GermanyAntiquariat Klaus Altschäfl
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Add to basket143 S. 8°. Orig.Ganzleinen So gut wie verlagsfrisch erhalten.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
- First Edition
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .…
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In English.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New.
Published by München, "Die Brücke". Im Auftrag der Seliger-Gemeinde, o. J.
- Hardcover
Seller: Antiquariat Klaus Altschäfl, Pfarrkirchen, GermanyAntiquariat Klaus Altschäfl
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Add to basket80 S. 8°. Orig.Ganzleinen Einband leicht verfärbt und der hintere Einbanddeckel minimal gebogen; innen in jeder Hinsicht sehr gut erhalten.
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
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Condition: New. pp. viii + 189.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, M. (Editor)/ Grill, A. (Editor)/ Lacopi, F. (Editor)/ Koike, J. (Editor)/ Usui, T. (Editor)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.…
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.…
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
