Ricky Lee (383 results)

Paperback. Condition: Very Good. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Condition: Very Good. This book is in very good condition and will be shipped within 24 hours of ordering. The cover may have some limited signs of wear but the pages are clean, intact and the spine remains undamaged. This book has clearly been well maintained and looked after thus far. Money back guarantee if you are not satisfied. See all our books here, order more than 1 book and get discounted shipping. .…

Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condition: New. Brand New! Not Overstocks or Low Quality Book Club Editions! Direct From the Publisher! We're not a giant, faceless warehouse organization! We're a small town bookstore that loves books and loves it's customers! Buy from Lakeside Books.

Condition: Very Good. Shipped within 24 hours from our UK warehouse. Clean, undamaged book with no damage to pages and minimal wear to the cover. Spine still tight, in very good condition. Remember if you are not happy, you are covered by our 100% money back guarantee.

Condition: As New. Unread book in perfect condition.

paperback. Condition: Good. This is a used book in good condition and may show some signs of use or wear . This is a used book in good condition and may show some signs of use or wear .

Condition: Very Good. : Este libro técnico es una guía exhaustiva sobre el diseño, materiales, procesos, fiabilidad y aplicaciones de los paquetes a escala de chip (CSP). Escrito por los expertos John H. Lau y Ricky S. W. Lee, la obra profundiza en las innovaciones tecnológicas necesarias para la miniaturización de componentes electrónicos.Es un recurso esencial para ingenieros y profesionales del sector de semiconductores, proporcionando un análisis detallado de los desafíos de fabricación y las soluciones de ingeniería en el empaquetado de circuitos integrados modernos. EAN: 0639785306085 Tipo: Libros Categoría: Tecnología|Ciencias Título: Chip scale package Autor: John H. Lau| Ricky S. W. Lee Editorial: McGraw-Hill Idioma: en Páginas: 500 Formato: tapa dura.…

Paperback. Condition: Very Good. No Jacket. Former library book; May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Condition: New.

Condition: New.

Paperback. Condition: Good+. 280 pages; light creasing on spine. Light creasing / curl on back cover's top corner and the last few pages' top corner. Very Good condition otherwise. No other noteworthy defects. No markings. ; - Your satisfaction is our priority. We offer free returns and respond promptly to all inquiries. Your item will be packaged with care and ship on the same or next business day. Buy with confidence. 1st Edition (Unstated); No Printing Stated.…

Condition: New.

Condition: Good. : Este libro técnico proporciona una guía exhaustiva sobre las tecnologías de microvías y WLCSP, fundamentales para el diseño y la fabricación de sistemas de interconexión de alta densidad y bajo costo. A través de sus páginas, los autores John H. Lau y S.W. Ricky Lee exploran métodos para crear sistemas electrónicos más eficientes y fiables, incluyendo más de 500 ilustraciones detalladas y fotografías que facilitan la comprensión de procesos complejos como la perforación láser y mecánica en placas de circuito impreso.Dirigido a profesionales y académicos del área de la ingeniería electrónica y de telecomunicaciones, el texto aborda temas críticos como los materiales electrónicos, el control de costes en la construcción de circuitos integrados y las tecnologías de empaquetado microelectrónico. Es una referencia esencial para aquellos interesados en las últimas innovaciones en hardware y componentes de circuitos. EAN: 0639785322092 Tipo: Libros Categoría: Tecnología Título: Microvias: For Low Cost, High Density Interconnects Autor: John H. Lau| S.W. Ricky Lee Editorial: McGraw-Hill Professional Idioma: en Páginas: 565 Formato: tapa dura.…

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.

Paperback. Condition: Brand New. 112 pages. 9.25x7.50x0.28 inches. In Stock.