Rymaszewski Eugene J Edt (8 results)

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Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New
US$ 190.70
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Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New
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Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: Used - As new
US$ 256.29
US$ 20.18 shipping
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Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: New
US$ 267.14
US$ 2.64 shipping
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Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
5-star seller
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Condition: Used - As new
US$ 275.71
US$ 2.64 shipping
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Quantity: 15 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
5-star seller
Contact seller
Condition: Used - As new
US$ 396.22
US$ 20.18 shipping
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
5-star seller
Contact seller
Condition: Used - As new
US$ 416.44
US$ 2.64 shipping
Ships within U.S.A.
Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.