Rymaszewski Eugene J Edt (8 results)

Author:

Refine with Advanced Search

Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
5-star seller
Contact seller
Condition: New
US$ 199.35
US$ 2.64 shipping
Ships within U.S.A.
Quantity: 15 available
Condition: New.
Discover more from the contributors
View Rao R. Tummala and Alan G. Klopfenstein to explore their published works and collectible offers.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
5-star seller
Contact seller
Condition: New
US$ 190.99
US$ 20.27 shipping
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
5-star seller
Contact seller
Condition: New
US$ 251.75
US$ 20.27 shipping
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
5-star seller
Contact seller
Condition: Used - As new
US$ 257.55
US$ 20.27 shipping
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
5-star seller
Contact seller
Condition: New
US$ 269.65
US$ 2.64 shipping
Ships within U.S.A.
Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
5-star seller
Contact seller
Condition: Used - As new
US$ 277.55
US$ 2.64 shipping
Ships within U.S.A.
Quantity: 15 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
5-star seller
Contact seller
Condition: Used - As new
US$ 398.16
US$ 20.27 shipping
Ships from United Kingdom to U.S.A.
Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
5-star seller
Contact seller
Condition: Used - As new
US$ 418.16
US$ 2.64 shipping
Ships within U.S.A.
Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.