Sharma Manvinder (42 results)
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Singh, Dr. Harjinder; Sappal, Dr. Amandeep Singh; Sharma, Manvinder
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Paperback. Condition: Brand New. 68 pages. 8.66x5.91x0.16 inches. In Stock.
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Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. 64 pages. 8.66x5.98x0.32 inches. In Stock.
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Taschenbuch. Condition: Neu. Grain Structures & Effects of Stress on Grain Boundaries | Manvinder Sharma (u. a.) | Taschenbuch | 68 S. | Englisch | 2018 | LAP LAMBERT Academic Publishing | EAN 9786139877874 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de…| Anbieter: preigu.
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Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | From the comparison of TORA and OLSR the results of my simulations conclude that for the same Scenario OLSR is better for those conditions where bandwidth is no issue, but time and accuracy is preferred. The comparative study on global and nodal an…alysis of various two ad hoc routing protocols OLSR and TORA. The study of these routing protocols shows that OLSR is more efficient in dense scenario comparative to TORA. OLSR requires that it continuously have some bandwidth in order to receive the topology updates messages. TORA performs much better in packet delivery owing to selection of better routes using acyclic graph. It has been concluded that performance of TORA is better for when time is no constraint. TORA also saves so much bandwidth as comparative to OLSR. The future work suggested that the effort will be made to enhance ad hoc network routing protocol by tackling core issues.
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Taschenbuch. Condition: Neu. Estructuras de grano y efectos de la tensión en los límites de grano | Manvinder Sharma (u. a.) | Taschenbuch | Spanisch | 2023 | Ediciones Nuestro Conocimiento | EAN 9786205652114 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]…de | Anbieter: preigu.
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Taschenbuch. Condition: Neu. Structures des grains et effets des contraintes sur les limites des grains | Manvinder Sharma (u. a.) | Taschenbuch | Französisch | 2023 | Editions Notre Savoir | EAN 9786205652138 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]…de | Anbieter: preigu.
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Taschenbuch. Condition: Neu. Kornstrukturen und Auswirkungen von Spannungen auf Korngrenzen | Manvinder Sharma (u. a.) | Taschenbuch | 60 S. | Deutsch | 2023 | Verlag Unser Wissen | EAN 9786205652107 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbie…ter: preigu.
Language: English
Published by LAP LAMBERT Academic Publishing Jul 2018, 2018
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grai…n boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space. 68 pp. Englisch.
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Singh, Dr. Harjinder; Sappal, Dr. Amandeep Singh; Sharma, Manvinder
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Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Singh, Dr. Harjinder; Sappal, Dr. Amandeep Singh; Sharma, Manvinder
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Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Language: Spanish
Published by Ediciones Nuestro Conocimiento Jan 2023, 2023
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -El desarrollo de dispositivos microelectrónicos de mayor densidad es el impacto de las tensiones inducidas por los desajustes del coeficiente de expansión térmica (CET) de los materiales utilizados. En este artículo se analiza el us…o de la modelización continua de granos en 3D para estudiar la migración de los límites de grano provocada por las diferencias en la densidad de energía de deformación. Se está utilizando Comsol Multiphysics 4.3a (CM) para calcular tensiones y densidades de energía de deformación en estructuras policristalinas causadas por cambios de temperatura. Tratamos cada grano como un único cristal, con las propiedades elásticas anisótropas del monocristal de Cu adecuadamente rotadas para que coincidan con la orientación del grano en el espacio. 60 pp. Spanisch.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Khosla DishantDishant Khosla, is currently working as Assistant Professor at Chandigarh Group of Colleges, Landran(Punjab), India. He has completed his M.Tech from UCOE, Punjabi University, Patiala(Punj…ab), India. He has more than 7.
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Dr. Harjinder Singh|Dr. Amandeep Singh Sappal|Manvinder Sharma
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Seller: moluna, Greven, Germanymoluna
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Singh Dr. HarjinderDr. Harjinder Singh is Assistant Professor in department of electronics and communication at Punjabi University Patiala.Face to Face Stacking on Wafer to Wafer (WoW) can be done for t…he Cu-Cu direct bonding int.
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Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Palta PankajPankaj Palta working as Assistant Professor in Chandigarh Group of Colleges Landran, Mohali Punjab. He has born in Amritsar Punjab, India. He done is M. Tech in Elec…tronics and Communication from Punjabi University, Pati.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Sharma ManvinderManvinder Sharma is currently working as Assistant Professor in Department of Electronics and Communication at CGC College of Engineering, Mohali. He has done M.Tech in VLSI and B.Tech i…n ECE.Developing higher den.
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Le développement de dispositifs microélectroniques de plus haute densité est l'impact des contraintes induites par les disparités de coefficient de dilatation thermique (CTE) des matériaux utilisés. Je discute ici de l'utilisation d…e la modélisation 3D du continuum des grains pour étudier la migration des joints de grains induite par les différences de densité d'énergie de déformation. Comsol Multiphysics 4.3a (CM) est utilisé pour calculer les contraintes et les densités d'énergie de déformation dans les structures polycristallines causées par les changements de température. Nous traitons chaque grain comme un monocristal, avec les propriétés élastiques anisotropes du monocristal de Cu tournées de manière appropriée pour correspondre à l'orientation du grain dans l'espace. 60 pp. Französisch.
Language: English
Published by LAP LAMBERT Academic Publishing Jul 2018, 2018
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Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain bo…undary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 68 pp. Englisch.
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain bou…ndary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.
Language: Spanish
Published by Ediciones Nuestro Conocimiento Jan 2023, 2023
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Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -El desarrollo de dispositivos microelectrónicos de mayor densidad es el impacto de las tensiones inducidas por los desajustes del coeficiente de expansión térmica (CET) de los materiales utilizados. En este artículo se analiza el uso de… la modelización continua de granos en 3D para estudiar la migración de los límites de grano provocada por las diferencias en la densidad de energía de deformación. Se está utilizando Comsol Multiphysics 4.3a (CM) para calcular tensiones y densidades de energía de deformación en estructuras policristalinas causadas por cambios de temperatura. Tratamos cada grano como un único cristal, con las propiedades elásticas anisótropas del monocristal de Cu adecuadamente rotadas para que coincidan con la orientación del grano en el espacio.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 60 pp. Spanisch.
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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - El desarrollo de dispositivos microelectrónicos de mayor densidad es el impacto de las tensiones inducidas por los desajustes del coeficiente de expansión térmica (CET) de los materiales utilizados. En este artículo se analiza el uso de…la modelización continua de granos en 3D para estudiar la migración de los límites de grano provocada por las diferencias en la densidad de energía de deformación. Se está utilizando Comsol Multiphysics 4.3a (CM) para calcular tensiones y densidades de energía de deformación en estructuras policristalinas causadas por cambios de temperatura. Tratamos cada grano como un único cristal, con las propiedades elásticas anisótropas del monocristal de Cu adecuadamente rotadas para que coincidan con la orientación del grano en el espacio.
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Lo sviluppo di dispositivi microelettronici a più alta densità è l'impatto delle sollecitazioni indotte dai disallineamenti del coefficiente di espansione termica (CTE) dei materiali utilizzati. Qui discuto l'uso della modellazione…3D del continuum dei grani per studiare la migrazione dei confini dei grani guidata da differenze nella densità di energia di deformazione. Comsol Multiphysics 4.3a (CM) viene utilizzato per calcolare le sollecitazioni e le densità di energia di deformazione nelle strutture policristalline causate da variazioni di temperatura. Trattiamo ogni grano come un cristallo singolo, con le proprietà elastiche anisotrope del cristallo singolo Cu opportunamente ruotate per corrispondere all'orientamento del grano nello spazio. 60 pp. Italienisch.
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Bei der Entwicklung von mikroelektronischen Geräten mit höherer Dichte wirken sich die Spannungen aus, die durch unterschiedliche Wärmeausdehnungskoeffizienten (WAK) der verwendeten Materialien verursacht werden. Hier erörtere ich d…en Einsatz der 3D-Kornkontinuumsmodellierung zur Untersuchung der durch Unterschiede in der Dehnungsenergiedichte verursachten Korngrenzenmigration. Comsol Multiphysics 4.3a (CM) wird zur Berechnung von Spannungen und Dehnungsenergiedichten in polykristallinen Strukturen verwendet, die durch Temperaturänderungen verursacht werden. Wir behandeln jedes Korn als Einkristall, wobei die anisotropen elastischen Eigenschaften von einkristallinem Cu entsprechend gedreht werden, um der Kornorientierung im Raum zu entsprechen. 60 pp. Deutsch.
Language: Portuguese
Published by Edições Nosso Conhecimento Jan 2023, 2023
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -O desenvolvimento de dispositivos microelectrónicos de maior densidade é o impacto das tensões induzidas pelos desajustes de Coeficiente de Expansão Térmica (CTE) dos materiais utilizados. Aqui discuto a utilização da modelação cont…ínua de grão 3D para estudar a migração de limites de grão impulsionada por diferenças na densidade de energia de deformação. A Comsol Multiphysics 4.3a (CM) está a ser utilizada para calcular as tensões e densidades de energia de deformação em estruturas policristalinas causadas por alterações de temperatura. Tratamos cada grão como um único cristal, com as propriedades elásticas anisotrópicas de um único cristal Cu devidamente rodado para corresponder à orientação do grão no espaço. 60 pp. Portugiesisch.
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Le développement de dispositifs microélectroniques de plus haute densité est l'impact des contraintes induites par les disparités de coefficient de dilatation thermique (CTE) des matériaux utilisés. Je discute ici de l'utilisation de la… modélisation 3D du continuum des grains pour étudier la migration des joints de grains induite par les différences de densité d'énergie de déformation. Comsol Multiphysics 4.3a (CM) est utilisé pour calculer les contraintes et les densités d'énergie de déformation dans les structures polycristallines causées par les changements de température. Nous traitons chaque grain comme un monocristal, avec les propriétés élastiques anisotropes du monocristal de Cu tournées de manière appropriée pour correspondre à l'orientation du grain dans l'espace.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 60 pp. Französisch.
