Sharma Manvinder (43 results)

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    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139858240 / 9786139858248

      • Softcover

      Seller: Books Puddle, New York, NY, U.S.A.Books Puddle

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    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2019

      6139460565 / 9786139460564

      • Softcover

      Seller: Revaluation Books, Exeter, United KingdomRevaluation Books

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      Paperback. Condition: Brand New. 64 pages. 8.66x5.98x0.32 inches. In Stock.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139877873 / 9786139877874

      • Softcover

      Seller: Revaluation Books, Exeter, United KingdomRevaluation Books

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      Paperback. Condition: Brand New. 68 pages. 8.66x5.91x0.16 inches. In Stock.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139877873 / 9786139877874

      • Softcover

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      Taschenbuch. Condition: Neu. Grain Structures & Effects of Stress on Grain Boundaries | Manvinder Sharma (u. a.) | Taschenbuch | 68 S. | Englisch | 2018 | LAP LAMBERT Academic Publishing | EAN 9786139877874 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2019

      6139460565 / 9786139460564

      • Softcover

      Seller: Buchpark, Trebbin, GermanyBuchpark

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      Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | From the comparison of TORA and OLSR the results of my simulations conclude that for the same Scenario OLSR is better for those conditions where bandwidth is no issue, but time and accuracy is preferred. The comparative study on global and nodal analysis of various two ad hoc routing protocols OLSR and TORA. The study of these routing protocols shows that OLSR is more efficient in dense scenario comparative to TORA. OLSR requires that it continuously have some bandwidth in order to receive the topology updates messages. TORA performs much better in packet delivery owing to selection of better routes using acyclic graph. It has been concluded that performance of TORA is better for when time is no constraint. TORA also saves so much bandwidth as comparative to OLSR. The future work suggested that the effort will be made to enhance ad hoc network routing protocol by tackling core issues.

    • Language: French

      Published by Editions Notre Savoir, 2022

      6205542536 / 9786205542538

      • Softcover

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    • Language: French

      Published by Editions Notre Savoir, 2023

      6205652137 / 9786205652138

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    • Language: French

      Published by Editions Notre Savoir, 2023

      6205652137 / 9786205652138

      • Softcover

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      Taschenbuch. Condition: Neu. Structures des grains et effets des contraintes sur les limites des grains | Manvinder Sharma (u. a.) | Taschenbuch | Französisch | 2023 | Editions Notre Savoir | EAN 9786205652138 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.

    • Language: Italian

      Published by Edizioni Sapienza, 2022

      6205542544 / 9786205542545

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    • Language: Portuguese

      Published by Edições Nosso Conhecimento, 2022

      6205542552 / 9786205542552

      • Softcover

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    • Language: Portuguese

      Published by Edições Nosso Conhecimento, 2023

      6205652161 / 9786205652169

      • Softcover

      Seller: moluna, Greven, Germanymoluna

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    • Language: Portuguese

      Published by Edições Nosso Conhecimento, 2023

      6205652161 / 9786205652169

      • Softcover

      Seller: preigu, Osnabrück, Germanypreigu

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      Taschenbuch. Condition: Neu. Estruturas de Grãos e Efeitos do Stress sobre os Limites dos Grãos | Manvinder Sharma (u. a.) | Taschenbuch | Portugiesisch | 2023 | Edições Nosso Conhecimento | EAN 9786205652169 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.

    • Language: Italian

      Published by Edizioni Sapienza, 2023

      6205652196 / 9786205652190

      • Softcover

      Seller: preigu, Osnabrück, Germanypreigu

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      Taschenbuch. Condition: Neu. Strutture dei grani ed effetti delle sollecitazioni sui confini dei grani | Manvinder Sharma (u. a.) | Taschenbuch | Italienisch | 2023 | Edizioni Sapienza | EAN 9786205652190 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.

    • Language: German

      Published by Verlag Unser Wissen, 2023

      6205652102 / 9786205652107

      • Softcover

      Seller: preigu, Osnabrück, Germanypreigu

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      Taschenbuch. Condition: Neu. Kornstrukturen und Auswirkungen von Spannungen auf Korngrenzen | Manvinder Sharma (u. a.) | Taschenbuch | 60 S. | Deutsch | 2023 | Verlag Unser Wissen | EAN 9786205652107 | Verantwortliche Person für die EU: SIA OmniScriptum Publishing, Brivibas Gatve 197, 1039 RIGA, LETTLAND, customerservice[at]vdm-vsg[dot]de | Anbieter: preigu.

    • Language: English

      Published by LAP LAMBERT Academic Publishing Jul 2018, 2018

      6139877873 / 9786139877874

      • Softcover
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      Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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      Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space. 68 pp. Englisch.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139858240 / 9786139858248

      • Softcover
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      Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139858240 / 9786139858248

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      Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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    • Language: Spanish

      Published by Ediciones Nuestro Conocimiento Jan 2023, 2023

      6205652110 / 9786205652114

      • Softcover
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      Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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      Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -El desarrollo de dispositivos microelectrónicos de mayor densidad es el impacto de las tensiones inducidas por los desajustes del coeficiente de expansión térmica (CET) de los materiales utilizados. En este artículo se analiza el uso de la modelización continua de granos en 3D para estudiar la migración de los límites de grano provocada por las diferencias en la densidad de energía de deformación. Se está utilizando Comsol Multiphysics 4.3a (CM) para calcular tensiones y densidades de energía de deformación en estructuras policristalinas causadas por cambios de temperatura. Tratamos cada grano como un único cristal, con las propiedades elásticas anisótropas del monocristal de Cu adecuadamente rotadas para que coincidan con la orientación del grano en el espacio. 60 pp. Spanisch.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139859395 / 9786139859399

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      Seller: moluna, Greven, Germanymoluna

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      Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Khosla DishantDishant Khosla, is currently working as Assistant Professor at Chandigarh Group of Colleges, Landran(Punjab), India. He has completed his M.Tech from UCOE, Punjabi University, Patiala(Punjab), India. He has more than 7.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139858240 / 9786139858248

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      Seller: moluna, Greven, Germanymoluna

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      Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Singh Dr. HarjinderDr. Harjinder Singh is Assistant Professor in department of electronics and communication at Punjabi University Patiala.Face to Face Stacking on Wafer to Wafer (WoW) can be done for the Cu-Cu direct bonding int.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139877873 / 9786139877874

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      Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Sharma ManvinderManvinder Sharma is currently working as Assistant Professor in Department of Electronics and Communication at CGC College of Engineering, Mohali. He has done M.Tech in VLSI and B.Tech in ECE.Developing higher den.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2019

      6139460565 / 9786139460564

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      Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Palta PankajPankaj Palta working as Assistant Professor in Chandigarh Group of Colleges Landran, Mohali Punjab. He has born in Amritsar Punjab, India. He done is M. Tech in Electronics and Communication from Punjabi University, Pati.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139859395 / 9786139859399

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      Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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      Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Digital image and video in their raw form require an enormous amount of storage capacity and the number of such applications is increasing day by day. Also the huge data systems also contain a lot of redundant information. As massive data transfer is taking place over communication links, compression of data to be stored or transmitted reduces storage space and transmission bandwidth as redundant information is removed. Compression also increases the capacity of the communication channel. Considering the important role played by digital imaging and video in today's world, it is necessary to develop a system that produces high degree of compression while preserving critical image or video information.

    • Language: English

      Published by LAP LAMBERT Academic Publishing, 2018

      6139877873 / 9786139877874

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      Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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      Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.

    • Language: French

      Published by Editions Notre Savoir Jan 2023, 2023

      6205652137 / 9786205652138

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      Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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      Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Le développement de dispositifs microélectroniques de plus haute densité est l'impact des contraintes induites par les disparités de coefficient de dilatation thermique (CTE) des matériaux utilisés. Je discute ici de l'utilisation de la modélisation 3D du continuum des grains pour étudier la migration des joints de grains induite par les différences de densité d'énergie de déformation. Comsol Multiphysics 4.3a (CM) est utilisé pour calculer les contraintes et les densités d'énergie de déformation dans les structures polycristallines causées par les changements de température. Nous traitons chaque grain comme un monocristal, avec les propriétés élastiques anisotropes du monocristal de Cu tournées de manière appropriée pour correspondre à l'orientation du grain dans l'espace. 60 pp. Französisch.

    • Language: English

      Published by LAP LAMBERT Academic Publishing Jul 2018, 2018

      6139877873 / 9786139877874

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      Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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      Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 68 pp. Englisch.

    • Language: Spanish

      Published by Ediciones Nuestro Conocimiento, 2022

      6205542528 / 9786205542521

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      Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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      Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - La imagen y el vídeo digitales en bruto requieren una enorme capacidad de almacenamiento y el número de aplicaciones de este tipo aumenta día a día. Además, los enormes sistemas de datos también contienen mucha información redundante. Dado que la transferencia masiva de datos se realiza a través de enlaces de comunicación, la compresión de los datos que se van a almacenar o transmitir reduce el espacio de almacenamiento y el ancho de banda de transmisión, ya que se elimina la información redundante. La compresión también aumenta la capacidad del canal de comunicación. Teniendo en cuenta el importante papel que desempeñan la imagen y el vídeo digitales en el mundo actual, es necesario desarrollar un sistema que produzca un alto grado de compresión preservando al mismo tiempo la información crítica de la imagen o el vídeo.

    • Language: Spanish

      Published by Ediciones Nuestro Conocimiento Jan 2023, 2023

      6205652110 / 9786205652114

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      Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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      Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -El desarrollo de dispositivos microelectrónicos de mayor densidad es el impacto de las tensiones inducidas por los desajustes del coeficiente de expansión térmica (CET) de los materiales utilizados. En este artículo se analiza el uso de la modelización continua de granos en 3D para estudiar la migración de los límites de grano provocada por las diferencias en la densidad de energía de deformación. Se está utilizando Comsol Multiphysics 4.3a (CM) para calcular tensiones y densidades de energía de deformación en estructuras policristalinas causadas por cambios de temperatura. Tratamos cada grano como un único cristal, con las propiedades elásticas anisótropas del monocristal de Cu adecuadamente rotadas para que coincidan con la orientación del grano en el espacio.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 60 pp. Spanisch.

    • Language: Spanish

      Published by Ediciones Nuestro Conocimiento, 2023

      6205652110 / 9786205652114

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      Seller: preigu, Osnabrück, Germanypreigu

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      Taschenbuch. Condition: Neu. Estructuras de grano y efectos de la tensión en los límites de grano | Manvinder Sharma (u. a.) | Taschenbuch | Spanisch | 2023 | Ediciones Nuestro Conocimiento | EAN 9786205652114 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand.

    • Language: Italian

      Published by Edizioni Sapienza Jan 2023, 2023

      6205652196 / 9786205652190

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      Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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      Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Lo sviluppo di dispositivi microelettronici a più alta densità è l'impatto delle sollecitazioni indotte dai disallineamenti del coefficiente di espansione termica (CTE) dei materiali utilizzati. Qui discuto l'uso della modellazione 3D del continuum dei grani per studiare la migrazione dei confini dei grani guidata da differenze nella densità di energia di deformazione. Comsol Multiphysics 4.3a (CM) viene utilizzato per calcolare le sollecitazioni e le densità di energia di deformazione nelle strutture policristalline causate da variazioni di temperatura. Trattiamo ogni grano come un cristallo singolo, con le proprietà elastiche anisotrope del cristallo singolo Cu opportunamente ruotate per corrispondere all'orientamento del grano nello spazio. 60 pp. Italienisch.