Singh Raminderpal (30 results)

HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: New.

HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.

Condition: new.

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: As New. Unread book in perfect condition.

Condition: New. In English.

Condition: New.

Hardcover. Condition: New. Brand new book, sourced directly from publisher. Dispatch time is 3-4 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Condition: New. pp. xxviii + 340 Illus.

Condition: New. "An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. " -Ron Wilson, EETimes "SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. Num Pages: 368 pages, index. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 240 x 163 x 26. Weight in Grams: 700. . 2003. 1st Edition. Hardcover. . . . . …

Condition: New. pp. xiv + 451 Illus.

Condition: New. pp. xxviii + 340 Index.

Condition: New. In the era of System-on-Chip, when large portions of the overall system are integrated on one large chip, designers are facing increasingly challenging issues. For the first time, this book is taking a closer look at the signal integrity problems faced by .

Condition: New. In English.

Condition: New. Singh provides hands-on and research knowledge to a broad audience to help them get past very serious design problems. It covers signal integrity effects in high performance radio frequency IC designs, and substrate coupling. Editor(s): Singh, Raminderpal. Num Pages: 472 pages, Ill. BIC Classification: TJFC; TJKR. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate; (XV) Technical / Manuals. Dimension: 286 x 216 x 33. Weight in Grams: 1356. . 2001. 1st Edition. Hardcover. . . . . …

Condition: New. pp. xiv + 451 1st Edition.

Hardcover. Condition: Brand New. 1st edition. 472 pages. 11.00x8.50x1.25 inches. In Stock.

Hardcover. Condition: Brand New. 1st edition. 368 pages. 9.25x6.25x0.75 inches. In Stock.

Condition: New. "An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. " -Ron Wilson, EETimes "SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. Num Pages: 368 pages, index. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 240 x 163 x 26. Weight in Grams: 700. . 2003. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland. …

Buch. Condition: Neu. Neuware - Dieses Buch hilft Ihnen bei der Lösung spezieller Probleme beim Design von kundenspezifischen integrierten Schaltkreisen und ASICs. Behandelt werden u.a. verschiedene Einflüsse auf die Signalintegrität für hochleistungsfähige Hochfrequenzschaltungen, ASIC-Designs bei Strukturbreiten von 0,18 Mikrometern und integrierte Custom-IC-Blocks in ASIC-Designs.…

Condition: New. Singh provides hands-on and research knowledge to a broad audience to help them get past very serious design problems. It covers signal integrity effects in high performance radio frequency IC designs, and substrate coupling. Editor(s): Singh, Raminderpal. Num Pages: 472 pages, Ill. BIC Classification: TJFC; TJKR. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate; (XV) Technical / Manuals. Dimension: 286 x 216 x 33. Weight in Grams: 1356. . 2001. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland. …

Condition: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…

Hardcover. Condition: new. Hardcover. "An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications." -Ron Wilson, EETimes "SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. This book is a comprehensive review of the technology and of the design methods that go with it." -Alberto Sangiovanni-Vincentelli Professor, University of California, Berkeley Cofounder, Chief Technology Officer, Member of Board Cadence Design Systems Inc. Filled with in-depth insights and expert advice, Silicon Germanium covers all the key aspects of this technology and its applications. Beginning with a brief introduction to and historical perspective of IBM's SiGe technology, this comprehensive guide quickly moves on to: * Detail many of IBM's SiGe technology development programs * Explore IBM's approach to device modeling and characterization-including predictive TCAD modeling * Discuss IBM's design automation and signal integrity knowledge and implementation methodologies * Illustrate design applications in a variety of IBM's SiGe technologies * Highlight details of highly integrated SiGe BiCMOS system-on-chip (SOC) design Written for RF/analog and mixed-signal designers, CAD designers, semiconductor students, and foundry process engineers worldwide, Silicon Germanium provides detailed insight into the modeling and design automation requirements for leading-edge RF/analog and mixed-signal products, and illustrates in-depth applications that can be implemented using IBM's advanced SiGe process technologies and design kits. "This volume provides an excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. But just as important is the window the text provides into the infrastructure-the process development, device modeling, and tool development." -Ron Wilson Silicon Engineering Editor, EETimes "This book chronicles the development of SiGe in detail, provides an in-depth look at the modeling and design automation requirements for making advanced applications using SiGe possible, and illustrates such applications as implemented using IBM's process technologies and design methods." -John Kelly Senior Vice President and Group Executive, Technology Group, IBM "An excellent introduction to the SiGe BiCMOS technology, from the underlying device physics to current applications. " -Ron Wilson, EETimes "SiGe technology has demonstrated the ability to provide excellent high-performance characteristics with very low noise, at high power gain, and with excellent linearity. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. …

Hardcover. Condition: Brand New. 1st edition. 368 pages. 9.25x6.25x0.75 inches. In Stock. This item is printed on demand.