Order Total (1 Item Items):
Shipping Destination:
Suhir (160 results)
Author:
suhir
Refine with Advanced Search
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (160)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
Collectible Attributes
- First Edition (5)
- Signed (No further results match this refinement)
- Dust Jacket (No further results match this refinement)
- Seller-Supplied Images (52)
- Not Print on Demand (120)
Language (2)
Free Shipping
Seller Location
Seller Rating
-
Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
-
-
Structural Analysis in Microelectronic and Fiber-Optic Systems : Basic Principles of Engineering Elasticity and Structural Analysis
Language: English
Published by Wiley & Sons, Incorporated, John, 1991
ISBN 10: 0442207719 ISBN 13: 9780442207717
Condition: Good. VOLUME 1. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
-
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 1991
ISBN 10: 1558991204 ISBN 13: 9781558991200
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.
-
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Volume 2.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
XXX, 735 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
-
Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
-
Condition: As New. Unread book in perfect condition.
-
-
Condition: New.
-
Structural Analysis in Microelectronic and Fiber-Optic Systems: Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 69.22
US$ 15.96 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
Condition: New.
-
US$ 65.70
US$ 20.64 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketPF. Condition: New.
-
Condition: As New. Unread book in perfect condition.
-
Human-in-the-Loop: Probabilistic Modeling of an Aerospace Mission Outcome
Language: English
Published by Taylor & Francis Ltd, 2021
ISBN 10: 0367781352 ISBN 13: 9780367781354
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 76.40
US$ 16.79 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
-
Condition: New. pp. lxii + 1460.
-
Human-in-the-loop : Probabilistic Modeling of an Aerospace Mission Outcome
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 76.38
US$ 19.99 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: New.
-
Condition: New. 1st edition NO-PA16APR2015-KAP.
-
Condition: New. pp. 436.
-
-
Human-in-the-loop : Probabilistic Modeling of an Aerospace Mission Outcome
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 77.49
US$ 19.99 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: As New. Unread book in perfect condition.
-
-
US$ 79.97
US$ 20.64 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketPF. Condition: New.
-
Condition: New. pp. lxii + 1460 Illus.
-
Condition: New.
-
Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 87.18
US$ 19.99 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
-
Structural Analysis in Microelectronic and Fiber-optic Systems: Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis: Vol 1
Language: English
Published by Springer Netherlands, 2013
ISBN 10: 9401165378 ISBN 13: 9789401165372
US$ 92.32
US$ 16.66 shipping
Ships from United Kingdom to U.S.A.Quantity: 2 available
Add to basketPaperback. Condition: Brand New. 436 pages. 8.98x6.06x1.02 inches. In Stock.
-
Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 88.14
US$ 19.99 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
-
Condition: New. 1st edition NO-PA16APR2015-KAP.
-
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Language: English
Published by Taylor & Francis Ltd, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 87.19
US$ 24.29 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
-
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 100.60
US$ 15.96 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
