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paperback. Condition: As New. No highlighting. Very minimal wear.
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Condition: very_good. Fast Free Shipping â" Very Good condition book with a firm cover and clean pages. Shows normal use and some light wear or limited notes markings. A solid, nice copy to enjoy.
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Condition: good. The item shows wear from consistent use, but it remains in good condition and works perfectly. All pages and cover are intact including the dust cover, if applicable . Spine may show signs of wear. Pages may include limited notes and highlighting. May NOT include discs, access code or other supplemental materials.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 42.86
US$ 16.12 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: As New. Unread book in perfect condition.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San . U.S.A.: Volume 990 (MRS Proceedings)
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
US$ 41.64
US$ 20.84 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPaperback. Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New. pp. 358.
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Understanding Government Budgets: A Guide to Practices in the Public Service, 2ND EDITION
Language: English
Published by Taylor & Francis Group, 2019
ISBN 10: 1138786306 ISBN 13: 9781138786301
Condition: New.
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Understanding Government Budgets: A Guide to Practices in the Public Service, 2ND EDITION
Language: English
Published by Taylor & Francis Group, 2019
ISBN 10: 1138786306 ISBN 13: 9781138786301
Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10?12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 62.43
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US$ 95.44
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Add to basketPaperback. Condition: Brand New. 2nd new edition. 136 pages. 0.04x0.04x0.04 inches. In Stock.
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Kartoniert / Broschiert. Condition: New. Public budgets follow rules of presentation and use terms that make sense to few outside the world of public finance. Moreover, practices vary widely among the thousands of governments across the globe, between federal, state, and local levels of governm.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 118.29
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics : Volume 990: Symposium Held April 10 12, 20
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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Condition: As New. Unread book in perfect condition.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 219.75
US$ 20.18 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketCondition: As New. Unread book in perfect condition.
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Understanding Government Budgets : A Guide to Practices in the Public Service
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 247.94
US$ 20.18 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketCondition: New.
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US$ 225.06
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Add to basketGebunden. Condition: New. Public budgets follow rules of presentation and use terms that make sense to few outside the world of public finance. Moreover, practices vary widely among the thousands of governments across the globe, between federal, state, and local levels of governm.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 (Paperback)
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Paperback. Condition: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.: Volume 990
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
US$ 41.13
US$ 13.46 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback. Condition: Brand New. 1st edition. 358 pages. 9.02x5.98x0.75 inches. In Stock. This item is printed on demand.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 47.86
US$ 20.92 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New. Print on Demand pp. 358.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New. PRINT ON DEMAND pp. 358.
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Understanding Government Budgets: A Guide to Practices in the Public Service, 2ND EDITION
Language: English
Published by Taylor & Francis Group, 2019
ISBN 10: 1138786306 ISBN 13: 9781138786301
Condition: New. PRINT ON DEMAND.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 (Paperback)
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
US$ 51.95
US$ 49.79 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback. Condition: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
