Zschech Ehrenfried (77 results)

- Hardcover
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, GermanyAntiquariat Thomas Haker GmbH & Co. KG
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Condition: Used - Fine
US$ 7.63
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Hardcover/Pappeinband. Condition: Sehr gut. 527 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 984.

- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 45.71
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Condition: New.

- Hardcover
Seller: BargainBookStores, Grand Rapids, MI, U.S.A.BargainBookStores
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US$ 48.36
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Hardback or Cased Book. Condition: New. Characterization of Nanomaterials. Book.

- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 47.98
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Condition: As New. Unread book in perfect condition.

- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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Condition: New.

- Hardcover
Seller: Rarewaves USA, HEBRON, KY, U.S.A.Rarewaves USA
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Hardback. Condition: New.
More images- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
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Hardback. Condition: New.

- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 49.60
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Condition: New.

- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 56.70
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Condition: New. In English.

- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: As New. Unread book in perfect condition.
More images- Hardcover
Seller: Rarewaves USA United, HEBRON, KY, U.S.A.Rarewaves USA United
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US$ 57.88
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Hardback. Condition: New.

- Hardcover
Seller: unifachbuch e.K., Köln, NRW, Germanyunifachbuch e.K.
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Gebunden. Condition: Neu. Neu -Innovative Werkstoffe werden zukünftig ebenso wie Hochtechnologien mehr und mehr den wirtschaftlichen und gesellschaftlichen Fortschritt eines Landes, einer Region, ja der gesamten Welt bestimmen. Das vorliegende Buch vermittelt Werkstoffvisionen für das nächste Jahrhundert, vor allem aber realistische Entwicklungstrends. 150 pp. Deutsch.…

Language: English
Published by Secaucus, New Jersey, U.S.A.: Springer Verlag, 2005
- Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.Bingo Books 2
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US$ 127.00
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Hardcover. Condition: Near Fine. 3rd Edition. 3rd ed.hardback book in near fine condition.
More images- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
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US$ 54.66
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Hardback. Condition: New.

- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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US$ 145.56
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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US$ 145.56
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

- Hardcover
- First Edition
Seller: Wanda Schwörer, Engelsbrand, GermanyWanda Schwörer
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US$ 4.69
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Pp. Condition: Gut. 1. Aufl. 150 S. : Ill., graph. Darst. ; 25 cm gutes bis sehr gutes Exemplar Sprache: Deutsch Gewicht in Gramm: 472.

- Hardcover
Seller: INDOO, Avenel, NJ, U.S.A.INDOO
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US$ 195.88
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Condition: New.

Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 193.27
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Condition: New.

- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: Used
US$ 206.93
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Condition: Used. pp. 532.

- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: Used
US$ 213.70
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Condition: Used. pp. 532 Illus.

- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: Used
US$ 225.95
US$ 11.32 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Used. pp. 532.

Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 267.00
US$ 19.86 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.

- Hardcover
Seller: Ubiquity Trade, Miami, FL, U.S.A.Ubiquity Trade
Contact seller5-star sellerCondition: New
US$ 281.98
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Condition: New. Brand new! Please provide a physical shipping address.

- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 256.35
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 283.94
US$ 14.95 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.

- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 216.82
US$ 79.67 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Materials for Information Technology | Devices, Interconnects and Packaging | Ehrenfried Zschech (u. a.) | Taschenbuch | Engineering Materials and Processes | xix | Englisch | 2010 | Springer | EAN 9781849969673 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 283.94
US$ 19.78 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.

Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
US$ 295.74
US$ 10.81 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . …

- Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 316.17
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 532.