Zschech Ehrenfried (80 results)
- Hardcover
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, GermanyAntiquariat Thomas Haker GmbH & Co. KG
Contact seller5-star sellerAssociation member: GIAQ
Condition: Used - Fine
US$ 7.50
US$ 22.38 shippingShips from Germany to U.S.A.Quantity: 1 available
Hardcover/Pappeinband. Condition: Sehr gut. 527 p. Very good. Shrink wrapped. / Sehr guter Zustand. In Folie verschweißt. Sprache: Englisch Gewicht in Gramm: 984.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 45.71
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Condition: New.
- Hardcover
Seller: BargainBookStores, Grand Rapids, MI, U.S.A.BargainBookStores
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US$ 48.36
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Hardback or Cased Book. Condition: New. Characterization of Nanomaterials. Book.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 47.98
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Rarewaves USA, HEBRON, KY, U.S.A.Rarewaves USA
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US$ 54.66
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Hardback. Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 53.00
US$ 3.00 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
More images- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
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US$ 56.01
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Hardback. Condition: New.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 50.24
US$ 20.11 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
US$ 65.97
US$ 3.75 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 56.63
US$ 20.11 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: unifachbuch e.K., Köln, NRW, Germanyunifachbuch e.K.
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US$ 2.82
US$ 50.36 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: Neu. Neu -Innovative Werkstoffe werden zukünftig ebenso wie Hochtechnologien mehr und mehr den wirtschaftlichen und gesellschaftlichen Fortschritt eines Landes, einer Region, ja der gesamten Welt bestimmen. Das vorliegende Buch vermittelt Werkstoffvisionen für das nächste Jahrhundert, vor allem aber realistische Entwicklungstrends. 150 pp. Deutsch.…
More images- Hardcover
Seller: Rarewaves USA United, HEBRON, KY, U.S.A.Rarewaves USA United
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US$ 58.83
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Hardback. Condition: New.
Language: English
Published by Secaucus, New Jersey, U.S.A.: Springer Verlag, 2005
- Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.Bingo Books 2
Contact seller4-star sellerCondition: Used - Near fine
US$ 127.00
US$ 6.29 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Near Fine. 3rd Edition. 3rd ed.hardback book in near fine condition.
More images- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
Contact seller5-star sellerCondition: New
US$ 55.78
US$ 87.16 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Hardback. Condition: New.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 141.26
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 143.19
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
- First Edition
Seller: Wanda Schwörer, Engelsbrand, GermanyWanda Schwörer
Contact seller5-star sellerCondition: Used - Very good
US$ 4.61
US$ 58.76 shippingShips from Germany to U.S.A.Quantity: 1 available
Pp. Condition: Gut. 1. Aufl. 150 S. : Ill., graph. Darst. ; 25 cm gutes bis sehr gutes Exemplar Aufgrund der neuen PPWR-Bestimmungen (EU-Verpackungsverordnung) liefern wir derzeit nicht in EU-Mitgliedstaaten. Due to the new PPWR regulations (EU Packaging and Packaging Waste Regulation), we currently do not ship to EU Member States. Sprache: Deutsch Gewicht in Gramm: 472.…
- Hardcover
Seller: INDOO, Avenel, NJ, U.S.A.INDOO
Contact seller5-star sellerCondition: New
US$ 195.92
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Condition: New.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 193.31
US$ 2.64 shippingShips within U.S.A.Quantity: 3 available
Condition: New.
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: Used
US$ 204.62
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: Used. pp. 532.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 212.00
US$ 2.64 shippingShips within U.S.A.Quantity: 3 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: Used
US$ 211.94
US$ 8.72 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Used. pp. 532 Illus.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: Used
US$ 225.14
US$ 11.14 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Used. pp. 532.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 258.93
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 269.90
US$ 20.11 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 213.49
US$ 78.34 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Materials for Information Technology | Devices, Interconnects and Packaging | Ehrenfried Zschech (u. a.) | Taschenbuch | Engineering Materials and Processes | xix | Englisch | 2010 | Springer | EAN 9781849969673 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …
- Hardcover
Seller: Ubiquity Trade, Miami, FL, U.S.A.Ubiquity Trade
Contact seller4-star sellerCondition: New
US$ 281.98
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Condition: New. Brand new! Please provide a physical shipping address.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
US$ 290.80
US$ 10.63 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . …
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 278.68
US$ 39.17 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.…
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 274.89
US$ 54.83 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.
