Advanced Interconnects Ulsi Technology (12 results)
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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US$ 164.90
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 193.31
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Condition: New.
Advanced Interconnects for ULSI Technology Format: Hardcover
Mikhail Baklanov (IMEC); Paul S. Ho (University of Texas at Austin); Ehrenfried Zschech (Fraunhofer Inst. for Non-Destr. Testing)
- Hardcover
Seller: INDOO, Avenel, NJ, U.S.A.INDOO
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US$ 195.96
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Condition: New. Brand New.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 269.61
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Condition: New.
- Hardcover
Seller: Ubiquity Trade, Miami, FL, U.S.A.Ubiquity Trade
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US$ 281.98
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Condition: New. Brand new! Please provide a physical shipping address.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
US$ 302.13
US$ 11.05 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . …
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 279.89
US$ 56.96 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.
Advanced Interconnects for ULSI Technology
. Ed(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
US$ 352.33
US$ 10.50 shippingShips within U.S.A.Quantity: 15 available
Condition: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . Books ship from the US and Ireland. …
- Hardcover
- International Edition
Seller: UK BOOKS STORE, London, LONDO, United KingdomUK BOOKS STORE
Contact seller5-star sellerInternational EditionCondition: New
US$ 367.92
Free ShippingShips from United Kingdom to U.S.A.Quantity: 2 available
Condition: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 429.64
US$ 20.32 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 418.49
US$ 33.86 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Advanced Interconnects for ULSI Technology
Baklanov, Mikhail R. (EDT); Ho, Paul S. (EDT); Zschech, Ehrenfried (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 448.80
US$ 2.64 shippingShips within U.S.A.Quantity: 3 available
Condition: As New. Unread book in perfect condition.
