Mems Packaging (105 results)
Language: English
Published by Springer, 2004
- Hardcover
Seller: BMV Bloor, Toronto, ON, CanadaBMV Bloor
Contact seller5-star sellerCondition: Used - Very good
US$ 20.00
US$ 9.99 shippingShips from Canada to U.S.A.Quantity: 1 available
Condition: Very Good. Used - Very Good.
Language: English
Published by Springer, 2004
- Hardcover
Seller: GuthrieBooks, Spring Branch, TX, U.S.A.GuthrieBooks
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US$ 29.99
US$ 6.99 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. Sorry, No international shipping on this item.Ex-Library hardcover in very nice condition with all the usual markings and attachments. Text block clean and unmarked. Tight binding.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 61.35
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 64.00
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Condition: New.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 67.20
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
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US$ 72.93
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Hardback. Condition: New.
Language: English
Published by The Institution of Engineering and Technology, 2003
- Hardcover
Seller: StainesBookhub, Weybridge, SURRE, United KingdomStainesBookhub
Contact seller2-star sellerCondition: New
US$ 34.00
US$ 39.74 shippingShips from United Kingdom to U.S.A.Quantity: 3 available
Condition: New.
Language: English
Published by The Institution of Engineering and Technology, 2003
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 77.20
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by The Institution of Engineering and Technology, 2003
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 78.78
Free ShippingShips within U.S.A.Quantity: 2 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Language: English
Published by The Institution of Engineering and Technology, 2003
- Hardcover
Seller: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
Contact seller4-star sellerCondition: New
US$ 82.18
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 63.39
US$ 19.87 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: The Book Spot, Sioux Falls, MN, U.S.A.The Book Spot
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US$ 84.00
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Hardcover. Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 72.38
US$ 14.95 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.
- Hardcover
- First Edition
Seller: BOOKWEST, Phoenix, AZ, U.S.A.BOOKWEST
Contact seller3-star sellerCondition: Used - Very good
US$ 84.99
US$ 4.99 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. 1st Edition. SHIPS FROM USA TO LOCATIONS WITHIN USA. NO HIGHLIGHTING: UNUSED BOOK HAS A REMAINDER MARK AT ITS EDGE: SHIPS FROM USA TO LOCATIONS WITHIN USA.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 72.42
US$ 19.87 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Language: English
Published by Institution of Engineering & Technology, 2003
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 93.58
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: New. pp. 275.
Language: English
Published by Institution of Engineering & Technology, 2003
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 92.03
US$ 8.61 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: New. pp. 275.
Advanced Mems Packaging (electronic Engineering)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 119.18
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 119.18
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 119.18
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 122.21
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 122.21
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
Contact seller4-star sellerCondition: New
US$ 124.57
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
- Softcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 74.41
US$ 55.80 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 127.18
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: New.
Language: English
Published by Springer, 2004
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 132.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 128.55
US$ 8.61 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: New.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
US$ 135.64
US$ 11.33 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: New.
Language: English
Published by Springer, 2004
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 145.58
US$ 14.95 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 78.03
US$ 79.74 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Mixed-Domain Simulation and Wafer-Level Packaging of RF-MEMS Devices | An Itinerary through Two Key-Issues for the Successful Exploitation of RF-MEMS Technology | Jacopo Iannacci (u. a.) | Taschenbuch | 292 S. | Englisch | 2010 | LAP LAMBERT Academic Publishing | EAN 9783838364216 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.…
