Mems Packaging (106 results)
Language: English
Published by Springer, 2004
- Hardcover
Seller: BMV Bloor, Toronto, ON, CanadaBMV Bloor
Contact seller4-star sellerCondition: Used - Very good
US$ 20.00
US$ 9.99 shippingShips from Canada to U.S.A.Quantity: 1 available
Condition: Very Good. Used - Very Good.
Language: English
Published by Springer, 2004
- Hardcover
Seller: GuthrieBooks, Spring Branch, TX, U.S.A.GuthrieBooks
Contact seller5-star sellerCondition: Used - Very good
US$ 29.99
US$ 6.99 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. Sorry, No international shipping on this item.Ex-Library hardcover in very nice condition with all the usual markings and attachments. Text block clean and unmarked. Tight binding.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 61.35
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller5-star sellerCondition: New
US$ 64.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 67.20
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
Contact seller5-star sellerCondition: New
US$ 72.93
Free ShippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Hardback. Condition: New.
Language: English
Published by The Institution of Engineering and Technology, 2003
- Hardcover
Seller: StainesBookhub, Weybridge, SURRE, United KingdomStainesBookhub
Contact seller2-star sellerCondition: New
US$ 34.00
US$ 39.99 shippingShips from United Kingdom to U.S.A.Quantity: 3 available
Condition: New.
Language: English
Published by The Institution of Engineering and Technology, 2003
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 77.41
Free ShippingShips within U.S.A.Quantity: 3 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by The Institution of Engineering and Technology, 2003
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 78.44
Free ShippingShips within U.S.A.Quantity: 2 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 63.79
US$ 19.99 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: The Book Spot, Sioux Falls, MN, U.S.A.The Book Spot
Contact seller4-star sellerCondition: New
US$ 84.00
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 72.84
US$ 15.05 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 72.89
US$ 19.99 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
- First Edition
Seller: BOOKWEST, Phoenix, AZ, U.S.A.BOOKWEST
Contact seller3-star sellerCondition: Used - Very good
US$ 84.99
US$ 4.99 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. 1st Edition. SHIPS FROM USA TO LOCATIONS WITHIN USA. NO HIGHLIGHTING: UNUSED BOOK HAS A REMAINDER MARK AT ITS EDGE: SHIPS FROM USA TO LOCATIONS WITHIN USA.
Language: English
Published by Institution of Engineering & Technology, 2003
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 92.12
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: New. pp. 275.
Language: English
Published by Institution of Engineering & Technology, 2003
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 91.61
US$ 8.66 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: New. pp. 275.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 117.72
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 117.72
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Advanced Mems Packaging (electronic Engineering)
Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 119.28
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 120.71
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
Contact seller5-star sellerCondition: New
US$ 122.31
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Softcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 73.41
US$ 55.06 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 126.24
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: New.
Language: English
Published by Springer, 2004
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller5-star sellerCondition: New
US$ 132.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 129.17
US$ 8.66 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: New.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2018
Series: Book 5 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
US$ 136.11
US$ 11.18 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: New.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 76.98
US$ 78.67 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Mixed-Domain Simulation and Wafer-Level Packaging of RF-MEMS Devices | An Itinerary through Two Key-Issues for the Successful Exploitation of RF-MEMS Technology | Jacopo Iannacci (u. a.) | Taschenbuch | 292 S. | Englisch | 2010 | LAP LAMBERT Academic Publishing | EAN 9783838364216 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.…
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 76.98
US$ 78.67 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. THIN MEMBRANES FOR MEMS PACKAGING AT LOW T | THIN ELECTROPLATED MEMBRANES FOR MEMS PACKAGING AT TEMPERATURES BELOW 200 ºC | Raquel Hellín Rico | Taschenbuch | 224 S. | Englisch | 2010 | LAP LAMBERT Academic Publishing | EAN 9783838347134 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.…
- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
Contact seller5-star sellerCondition: New
US$ 73.13
US$ 86.64 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Hardback. Condition: New.
Language: English
Published by Springer, 2004
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 146.50
US$ 15.05 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.
