Micro Nanoelectronics (153 results)
- Hardcover
Seller: Books in my Basket, New Delhi, IndiaBooks in my Basket
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Hardcover. Condition: New. ISBN:9788170356226.
- Softcover
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- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Softcover
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- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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- Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
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Condition: New. pp. 204.
- Softcover
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- Softcover
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Condition: New. pp. 358.
- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.…
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.…
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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Paperback. Condition: New. Brand new book, sourced directly from publisher. Dispatch time is 7-8 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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US$ 132.77
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Condition: New. pp. 383.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
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Condition: New. pp. 383.
- Hardcover
Seller: StainesBookhub, Weybridge, SURRE, United KingdomStainesBookhub
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Condition: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
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- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Softcover
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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US$ 134.25
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Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Softcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. pp. 383.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
- First Edition
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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US$ 161.92
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Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .…
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New.
