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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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Microelectronics: Micro and Nanoelectronics and Photonics NAM SandT Centre
Language: English
Published by Daya Publishing House, 2009
ISBN 10: 8170356229 ISBN 13: 9788170356226
Hardcover. Condition: New. ISBN:9788170356226.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 42.67
US$ 16.05 shipping
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
US$ 39.89
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San . U.S.A.: Volume 990 (MRS Proceedings)
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
US$ 41.46
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New. pp. 204.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro - and Nanoelectronics
Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New. pp. 358.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10?12, 2007, San Francisco, California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New.
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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: As New. Unread book in perfect condition.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009 : Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics : Volume 990: Symposium Held April 10 12, 20
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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Micro- and Nanoelectronics : Emerging Device Challenges and Solutions
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Micro- and Nanoelectronics : Emerging Device Challenges and Solutions
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
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Micro- and Nanoelectronics
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
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Micro- and Nanoelectronics: Emerging Device Challenges and Solutions
Language: English
Published by Taylor & Francis Ltd, 2017
ISBN 10: 1138072346 ISBN 13: 9781138072343
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
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Micro- and Nanoelectronics (Devices, Circuits, and Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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