Micro Nanoelectronics (155 results)
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Hardcover
Seller: Books in my Basket, New Delhi, IndiaBooks in my Basket
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US$ 29.34
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Hardcover. Condition: New. ISBN:9788170356226.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 63.15
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Condition: New. pp. 204.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. 358.
- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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- Hardcover
Seller: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
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US$ 88.79
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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US$ 110.60
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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US$ 110.60
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 127.82
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Condition: As New. Unread book in perfect condition.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 65.85
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-…values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 69.24
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transis…tor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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US$ 135.78
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Condition: New. pp. 383.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 141.90
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Condition: New.
- Hardcover
Seller: BooksRun, Philadelphia, PA, U.S.A.BooksRun
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US$ 147.79
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Hardcover. Condition: Very Good. 1. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 148.00
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 146.35
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Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 149.00
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- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 133.53
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Condition: As New. Unread book in perfect condition.
- Softcover
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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US$ 150.20
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PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 134.86
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Condition: New.
- Softcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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US$ 147.74
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PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 150.39
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Condition: New. pp. 383.
