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Microelectronic Packaging (166 results)
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Microelectronic Packaging Handbook
Language: English
Published by Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
First Edition
Condition: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Microelectronic Packaging Handbook
Language: English
Published by Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
First Edition
Condition: Good. 1st Edition. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Microelectronic Packaging Handbook
Language: English
Published by Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Seller: Better World Books Ltd, Dunfermline, United Kingdom
Seller rating 5 out of 5 stars
First Edition
Condition: Good. 1st Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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SCIENTIFIC AMERICAN - July 1983: MICROELECTRONIC PACKAGING
Published by Scientific American, New York, 1983
Seller: David H. Gerber Books (gerberbooks), Austin, TX, U.S.A.
Seller rating 5 out of 5 stars
First Edition
Saddle-stapled. Condition: Good. Color and b&w illustrations (illustrator). Periodical. [132]pp [faint dampstain to front portion of magazine, with mild wrinkling] Larry Long and Diana DeAre - THE SLOWING OF URBANIZATION IN THE U.S.; Vincent Courtillot and Gregory E. Vink - HOW CONTINENTS BREAK UP; Lauren R. Donaldson and Timothy Joyner - THE SALMONID FISHES AS A NATURAL LIVESTOCK; Daniel L. Alkon - LEARNING IN A MARINE SNAIL; Albert J. Blodgett, Jr. - MICROELECTRONIC PACKAGING; Donald R. Kaplan - THE DEVELOPMENT OF PALM LEAVES; Nariman B. Mistry. - PARTICLES WITH NAKED BEAUTY; Derek Bickerton - CREOLE LANGUAGES Size: 4to - over 9¾" - 12" tall.
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hardcover. Condition: Good. Ex-library book with typical stickers and stampings. NO Priority Mail is available on this item. No international shipping.
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Thermal management concepts in microelectronic packaging: from component to system.
Language: English
Published by The International Society for Hybrid Microelectronics, 1984
ISBN 10: 0930815017 ISBN 13: 9780930815011
Trade paperback. Very good. No dust jacket as iss.
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Hardcover. Condition: Very Good. ex-company library,in near very good condition.
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Condition: Very Good. Used - Very Good.
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MICROELECTRONIC PACKAGING: Interconnection and Assembly of Integrated Circuits
Published by McGraw-Hill Book Company, New York, NY, U.S.A., 1968
First Edition
Hardcover. Condition: Good. No Jacket. 1st. With markings, normal wear/soil. Size: 4to. Ex-Library.
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Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.
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Microelectronic Packaging and Laser Processing. Volume 3184. Proceedings; 25-26 June, 1997; Singapore, China. SPIE.
Language: English
Published by The International Society for Optical Engineering, Bellingham, 1997
ISBN 10: 0819426113 ISBN 13: 9780819426116
Soft cover. Condition: Good. No Jacket. First. 230pp. W/full markings and pocket. Wear, Soil. Weight is 2 lb. Reprints are $85 from SPIE. Ex-Library Size: 4to. Book.
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Condition: Acceptable. SHIPS FAST. RESCUED + REPAIRED. Features a small coffee mishap, plus a reinforced binding, secured cover, and light annotations or highlighting-a durable, fully readable working copy brought back to life at a great value by our Book Sustainability Project. No access codes or CDs.
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Materials in Microelectronic and Optoelectronic Packaging. Ceramic Transactions Volume 33
Language: English
Published by Columbus: The American Ceramic Society, 1993
ISBN 10: 0944904637 ISBN 13: 9780944904633
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Seller rating 5 out of 5 stars
Condition: Fine. 471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!! - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
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Hardcover. Condition: Very Good. Book is in very nice condition, text is unmarked and pages are tight.
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Forse Sensors for Microelectronic Packaging Applications.
Book 2 of 17: Microtechnology and MEMSSeller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
149 figs., VIII, 178 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Microtechnology and Mems. Sprache: Englisch.
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Thermal Management of Microelectronic Equipment (Asme Press Book Series on Electronic Packaging)
Language: English
Published by American Society of Mechanical E, 2002
ISBN 10: 0791801683 ISBN 13: 9780791801680
hardcover. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority!
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Condition: New.
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Advanced Packaging for Microelectronic and Microsystem Applications
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
US$ 58.04
Free Shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPaperback. Condition: New.
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Condition: As New. Unread book in perfect condition.
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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 54.40
US$ 16.05 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. M�ller 2008-11-26, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
US$ 51.66
US$ 20.75 shipping
Ships from United Kingdom to U.S.A.Quantity: 10 available
Add to basketPaperback. Condition: New.
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 54.39
US$ 20.09 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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(S. A. Sci. American Vol. 249, No. 1) 1983. S. 1 - 12. gr8. m. zahlr. Abb. br. -2) Sonderabdruck Offprint.
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Hardcover. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. Sprache: Englisch Gewicht in Gramm: 550.
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Advanced Electronic Packaging (IEEE Press Series on Microelectronic Systems)
Language: English
Published by Wiley-IEEE Press (edition 2), 2006
ISBN 10: 0471466093 ISBN 13: 9780471466093
Hardcover. Condition: Very Good. 2. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.
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Condition: Like New. Page block firm and clean, binding unblemished, boards straight, without markings of any kind. Fine, like new condition. Extremely fine. Previous owners name on the inside of front endpaper. Well packaged and promptly shipped from California. Partnered with Friends of the Library since 2010.
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 62.06
US$ 20.09 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Plastic Packaging of Microelectronic Devices
Language: English
Published by Thomson Learning, New York, 1990
ISBN 10: 0442234945 ISBN 13: 9780442234942
Seller: Carpe Diem Fine Books, ABAA, Monterey, CA, U.S.A.
Association Member: ABAA ILAB TXBA
Seller rating 5 out of 5 stars
First Edition
Hardcover. 1st. 8vo. 377pp. Bibliography. Index. Illustrations. Review copy. Fine in fine dustjacket.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
