Microwave Microelectronics Packaging (42 results)
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 113.50
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Condition: New. In.
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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US$ 110.08
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Paperback. Condition: New.
- Hardcover
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.ThriftBooks-Atlanta
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US$ 133.96
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Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 163.39
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Condition: New. In.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 178.00
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Condition: New.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 190.44
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Condition: New.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 184.53
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Condition: New.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 197.18
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Condition: New. pp. 184.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 191.91
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Condition: New. In.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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US$ 191.91
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Condition: New. In.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 181.67
US$ 35.42 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechan…ical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 215.00
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Condition: New.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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US$ 146.17
US$ 81.29 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. RF and Microwave Microelectronics Packaging II | Ken Kuang (u. a.) | Taschenbuch | xii | Englisch | 2018 | Springer | EAN 9783319847191 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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US$ 224.02
US$ 16.90 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 172 pages. 9.25x6.25x0.50 inches. In Stock.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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US$ 208.56
US$ 35.42 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers…interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 208.56
US$ 35.42 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic resea…rchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 237.22
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Condition: New. pp. 304.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 167.58
US$ 81.29 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. RF and Microwave Microelectronics Packaging | Ken Kuang (u. a.) | Taschenbuch | xvi | Englisch | 2014 | Springer | EAN 9781489983244 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
Seller: Buchpark, Trebbin, GermanyBuchpark
Contact seller5-star sellerCondition: Used - Fine
US$ 147.82
US$ 121.94 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Sehr gut. Zustand: Sehr gut | Seiten: 285 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: New
US$ 258.95
US$ 33.79 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 310.45
US$ 20.27 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 299.33
US$ 33.79 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 330.46
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, GermanyBUCHSERVICE / ANTIQUARIAT Lars Lutzer
Contact seller5-star sellerCondition: Used - Very good
US$ 442.46
US$ 46.39 shippingShips from Germany to U.S.A.Quantity: 1 available
Hardcover. Condition: gut. 2009. RF and Microwave Microelectronics Packaging In englischer Sprache. pages.
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 131.89
US$ 6.39 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 131.89
US$ 7.90 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 166.37
US$ 26.71 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, elect…rical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 166.37
US$ 26.71 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and t…o academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 304 pp. Englisch.
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 166.37
US$ 26.71 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/R…F/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 141.88
US$ 56.89 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Com…panies in America and rank #2 in Sa.
