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Multichip Modules (122 results)
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Thin Film Multichip Modules
Language: English
Published by Intl Society of Hybrid, 1992
ISBN 10: 0930815335 ISBN 13: 9780930815332
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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MULTICHIP MODULES
Language: English
Published by World Scientific Publishing Comp, 1992
ISBN 10: 9810209258 ISBN 13: 9789810209254
hardcover. Condition: Very Good. Fast Shipping - Safe and Secure 7 days a week!
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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hardcover. Condition: Good. Ex-library book with typical stickers and stampings. NO Priority Mail is available on this item. No international shipping.
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MULTICHIP MODULES
Language: English
Published by World Scientific Publishing Company, 1992
ISBN 10: 9810209258 ISBN 13: 9789810209254
Condition: Used: Good. xlibrary 1992 hc no dj withdrawn stamp in book/ on edge of pages clean text has book plate 353 pages::: I-20.
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Advanced Electronic Packaging: With Emphasis on Multichip Modules (IEEE Press Series on Microelectronic Systems)
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.
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Condition: Acceptable. SHIPS FAST. RESCUED + REPAIRED. Features a small coffee mishap, plus a reinforced binding, secured cover, and light annotations or highlighting-a durable, fully readable working copy brought back to life at a great value by our Book Sustainability Project. No access codes or CDs.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Condition: good. Signs of wear and consistent use.
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Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Advanced Electronic Packaging: With Emphasis on Multichip Modules
Language: English
Published by IEEE Press., New York., 1999
ISBN 10: 0780347005 ISBN 13: 9780780347007
Seller: Zephyr Books LLC, Reno, NV, U.S.A.
Association Member: ABAA ILAB IOBA
Seller rating 5 out of 5 stars
Condition: Very Good. Heavy book, requires extra postage. A very good plus copy, no dustjacket. 8vo. xxxii, 789 pp. Hardcover, glossy pictorial boards.
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Multichip Modules
Language: English
Published by World Scientific, Singapore, 1992
ISBN 10: 9810209258 ISBN 13: 9789810209254
Seller: Webbooks, Wigtown, Wigtown, United Kingdom
Association Member: PBFA
Seller rating 5 out of 5 stars
First Edition
US$ 24.85
US$ 40.21 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: Very Good. Dust Jacket Condition: Very Good. First Edition. From a university library, usual stamps and labels. A00000325.
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Multichip Modules
Language: English
Published by World Scientific Publishing Co P, 1992
ISBN 10: 9810209258 ISBN 13: 9789810209254
US$ 49.71
US$ 16.28 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to baskethardcover. Condition: Very Good. Most of our very good books have only minor imperfections such as shelf wear consistent with a new book that's sat on a bookshop shelf for a year or two. Occasionally we may miss other minor imperfections as we have to grade books at speed. Our books are dispatched from a Yorkshire former cotton mill. We list via barcode/ISBN so please note that the images are stock images and may not be the exact copy you receive, furthermore the details about edition and year might not be accurate as many publishers reuse the same ISBN for multiple editions and as we simply scan a barcode or enter an ISBN we do not check the validity of the edition data when listing. If you're looking for an exact edition please don't order (at least not without checking with us first, although we don't always have time to check). We aim to dispatch prompty, the service used will depend on order value and book size. We can ship to most countries, see our shipping policies. Payment is via Abe only.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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MULTICHIP MODULES
Language: English
Published by World Scientific Publishing Company, 1992
ISBN 10: 9810209258 ISBN 13: 9789810209254
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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US$ 55.00
US$ 40.21 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: New.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)
Language: English
Published by IEEE Operations Center, 1991
ISBN 10: 087942267X ISBN 13: 9780879422677
US$ 107.22
US$ 8.71 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Used.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)
Language: English
Published by IEEE Operations Center, 1991
ISBN 10: 087942267X ISBN 13: 9780879422677
Condition: Used.
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Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies (IEEE Press Selected Reprint Series)
Language: English
Published by IEEE Operations Center, 1991
ISBN 10: 087942267X ISBN 13: 9780879422677
Condition: Used.
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Condition: New. Satisfaction Guaranteed or your money back.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: New.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: As New. Unread book in perfect condition.
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Multichip Modules with Integrated Sensors: 3 (closed)) (NATO Science Partnership Subseries: 3)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 133.75
US$ 16.06 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
