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Optoelectronic Packaging (21 results)
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Hardcover. Condition: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
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Optoelectronic Packaging (Wile
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc.
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Optoelectronic Packaging
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.
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Optoelectronic Packaging (Wiley Series in Microwave and Optical Engineering)
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
US$ 29.46
US$ 14.04 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Optoelectronic packaging : optische Netze - Komponenten - Aufbautechniken - Faser-Chip-Kopplung.
Language: German
Published by Berlin ; Offenbach : VDE-Verl., 2002
ISBN 10: 380072572X ISBN 13: 9783800725724
Seller: Wissenschaftliches Antiquariat Köln Dr. Sebastian Peters UG, Köln, Germany
Seller rating 5 out of 5 stars
Condition: sehr gut. 313 S., Abb., 21 cm. Sprache: Deutsch.
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Hardcover. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. Sprache: Englisch Gewicht in Gramm: 550.
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Materials in Microelectronic and Optoelectronic Packaging. Ceramic Transactions Volume 33
Language: English
Published by Columbus: The American Ceramic Society, 1993
ISBN 10: 0944904637 ISBN 13: 9780944904633
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Seller rating 5 out of 5 stars
Condition: Fine. *Price HAS BEEN REDUCED by 10% until Monday, June 29 (weekend SALE item)* 471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!! - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country. Photos available upon request.
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Optoelectronic Packaging
Language: English
Published by JOHN WILEY & SONS INC, 1997
ISBN 10: 0471111880 ISBN 13: 9780471111887
Condition: Sehr gut. Zustand: Sehr gut | Seiten: 280 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Hardcover. Condition: New.
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US$ 211.59
US$ 8.58 shipping
Ships from United Kingdom to U.S.A.Quantity: 3 available
Add to basketCondition: New. pp. 280.
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Hardcover. Condition: New.
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Semiconductor optoelectronic device packaging process (with DVD disc 1)(Chinese Edition)
Language: Chinese
Published by Publishing House of Electronics Industry, 1905
ISBN 10: 712112887X ISBN 13: 9787121128875
paperback. Condition: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto.
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LED packaging technology base and job tasks to resolve technical and vocational education . second five curriculum reform planning materials Optoelectronic Technology ( Information ) category(Chinese Edition)
Language: Chinese
Published by Huazhong University of Science and Technology Press, 2013
ISBN 10: 7560990673 ISBN 13: 9787560990675
paperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-08-01 Pages: 216 Language: Chinese Publisher: Huazhong University of Science and Technology Publishing House LED packaging technology base and job tasks to resolve technical and vocational education . second five curriculum reform planning materials Optoelectronic Technology ( Information ) class contains two parts: the first part introduces the basic concepts of the various aspects of LED industry chain and basic knowledge of the specific content including the LED s.Four Satisfaction guaranteed,or money back.
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Hardcover. Condition: New. Hardcover Pages Number: 433 Language: Chinese. Semiconductor Science and Technology Series: Optoelectronic devices microwave packaging and testing (2nd Edition) summary of years of work experience and recent research results. the system introduces high-speed optoelectronic devices test a total of 12 chapters. and practical techniques for microwave packaging design. advanced. academic and practical both the book and includes a semiconductor laser light modulation device and a photodetector thr.
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paperback. Condition: New. Language:Chinese.Paperback. Publisher: Science out.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Micro And Optoelectronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, Volumes 1
Published by Springer
ISBN 10: 0387279008 ISBN 13: 9780387279008
Condition: New.
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Micro And Optoelectronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, Volumes 1
Published by Springer
ISBN 10: 0387279008 ISBN 13: 9780387279008
US$ 305.58
US$ 8.58 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: New.
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Micro And Optoelectronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, Volumes 1
Published by Springer
ISBN 10: 0387279008 ISBN 13: 9780387279008
Condition: New.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
