Published by SPIE, 1988
ISBN 10: 0892528710 ISBN 13: 9780892528714
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Condition: Good. 379 pp., softcover, ex library, else text and binding clean, tight, and bright. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Published by Columbus: The American Ceramic Society, 1993
ISBN 10: 0944904637 ISBN 13: 9780944904633
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Condition: Fine. 471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!! - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Hardcover. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. Sprache: Englisch Gewicht in Gramm: 550.
Published by The International Society of Optical Engineering (SPIE), 1996
Seller: Best Books And Antiques, Chandler, TX, U.S.A.
Soft cover. Condition: Very Good. Has former owner's name on front cover. Otherwise, pristine. Volume 2691. February 1-2, 1996 in San Jose, California. Michael R. Feldman and Yung-Cheng Lee (Chairs/Editors). (BR) Box 63.
Published by Berlin ; Offenbach : VDE-Verl., 2002
ISBN 10: 380072572X ISBN 13: 9783800725724
Seller: Wissenschaftliches Antiquariat Köln Dr. Sebastian Peters UG, Köln, Germany
Condition: sehr gut. 313 S., Abb., 21 cm. Sprache: Deutsch.
Published by Publishing House of Electronics Industry, 1905
ISBN 10: 712112887X ISBN 13: 9787121128875
Seller: liu xing, Nanjing JiangSu, JS, China
paperback. Condition: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto.
ISBN 10: 7030191986 ISBN 13: 9787030191984
Seller: liu xing, Nanjing JiangSu, JS, China
paperback. Condition: New. Language:Chinese.Paperback. Publisher: Science out.
Published by Huazhong University of Science and Technology Press, 2013
ISBN 10: 7560990673 ISBN 13: 9787560990675
Seller: liu xing, Nanjing JiangSu, JS, China
paperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-08-01 Pages: 216 Language: Chinese Publisher: Huazhong University of Science and Technology Publishing House LED packaging technology base and job tasks to resolve technical and vocational education . second five curriculum reform planning materials Optoelectronic Technology ( Information ) class contains two parts: the first part introduces the basic concepts of the various aspects of LED industry chain and basic knowledge of the specific content including the LED s.Four Satisfaction guaranteed,or money back.
Published by Wiley-Interscience, 1997
ISBN 10: 0471111880 ISBN 13: 9780471111887
Seller: Giant Giant, Reston, VA, U.S.A.
hardcover. Condition: UsedVeryGood. Very Good condition.Crisp pages. Clean cover and pages. Book shows minimal shelf wear. No highlighting/marking. Not Satisfied? Contact us to get a refund.
More buying choices from other sellers on AbeBooks
New offers from US$ 134.47
Used offers from US$ 89.35
Also find Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Published by Science Press, 2011
ISBN 10: 7030330048 ISBN 13: 9787030330048
Seller: liu xing, Nanjing JiangSu, JS, China
Hardcover. Condition: New. Hardcover Pages Number: 433 Language: Chinese. Semiconductor Science and Technology Series: Optoelectronic devices microwave packaging and testing (2nd Edition) summary of years of work experience and recent research results. the system introduces high-speed optoelectronic devices test a total of 12 chapters. and practical techniques for microwave packaging design. advanced. academic and practical both the book and includes a semiconductor laser light modulation device and a photodetector thr.
Published by SPIE, 1996
ISBN 10: 0819420654 ISBN 13: 9780819420657
Seller: dsmbooks, Liverpool, United Kingdom
hardcover. Condition: Very Good. Very Good. book.
Published by Springer
ISBN 10: 0387279008 ISBN 13: 9780387279008
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New.
More buying choices from other sellers on AbeBooks
New offers from US$ 396.42