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Add to baskethardcover. Condition: Very Good. VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms: 26th IFIP WG 10.5/IEEE International Conference on Very . and Communication Technology, 561) This book is in very good condition and will be shipped within 24 hours of ordering. The cover may have some limited signs of wear but the pages are clean, intact and the spine remains undamaged. This book has clearly been well maintained and looked after thus far. Money back guarantee if you are not satisfied. See all our books here, order more than 1 book and get discounted shipping. .
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Add to baskethardcover. Condition: Very Good. Shipped within 24 hours from our UK warehouse. Clean, undamaged book with no damage to pages and minimal wear to the cover. Spine still tight, in very good condition. Remember if you are not happy, you are covered by our 100% money back guarantee.
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Add to basketX, 232 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Published by Springer International Publishing, 2016
ISBN 10: 3319273906 ISBN 13: 9783319273907
Language: English
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Published by Springer International Publishing, 2019
ISBN 10: 303023424X ISBN 13: 9783030234249
Language: English
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Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
Published by Springer-Nature New York Inc, 2020
ISBN 10: 3030234274 ISBN 13: 9783030234270
Language: English
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Add to basketPaperback. Condition: Brand New. 300 pages. 9.25x6.10x0.63 inches. In Stock.
Published by Springer, Berlin, Springer International Publishing, Springer, 2020
ISBN 10: 3030234274 ISBN 13: 9783030234270
Language: English
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
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Published by Springer International Publishing, Springer International Publishing Jun 2019, 2019
ISBN 10: 303023424X ISBN 13: 9783030234249
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
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Add to basketBuch. Condition: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018. The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 300 pp. Englisch.
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Published by Springer International Publishing, 2016
ISBN 10: 3319273906 ISBN 13: 9783319273907
Language: English
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Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics.By covering theoretical and practical aspects of smart device design, this book targets people who are working and studying on hardware/software modelling, component integration and simulation under different positions (system integrators, designers, developers, researchers, teachers, students etc.). In particular, it is a good introduction to people who have interest in managing heterogeneous components in an efficient and effective wayon different domains and different abstraction levels. People active in smart device development can understand both the current status of practice and future research directions. Provides a comprehensive overview of smart systems design, focusing on design challenges and cutting-edge solutions; Enables development of a co-simulation and co-design environment that accounts for the peculiarities of the basic subsystems and components to be integrated; Describes development of modeling and design techniques, methods and tools that enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.
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Published by Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3319801309 ISBN 13: 9783319801308
Language: English
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics.By covering theoretical and practical aspects of smart device design, this book targets people who are working and studying on hardware/software modelling, component integration and simulation under different positions (system integrators, designers, developers, researchers, teachers, students etc.). In particular, it is a good introduction to people who have interest in managing heterogeneous components in an efficient and effective wayon different domains and different abstraction levels. People active in smart device development can understand both the current status of practice and future research directions. Provides a comprehensive overview of smart systems design, focusing on design challenges and cutting-edge solutions; Enables development of a co-simulation and co-design environment that accounts for the peculiarities of the basic subsystems and components to be integrated; Describes development of modeling and design techniques, methods and tools that enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.
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Add to basketHardcover. Condition: Brand New. 244 pages. 9.25x6.25x0.75 inches. In Stock.
Published by Springer International Publishing, Springer International Publishing Mär 2016, 2016
ISBN 10: 3319273906 ISBN 13: 9783319273907
Language: English
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Add to basketBuch. Condition: Neu. Neuware -This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 244 pp. Englisch.
Published by Springer International Publishing, Springer International Publishing Apr 2018, 2018
ISBN 10: 3319801309 ISBN 13: 9783319801308
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
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Add to basketTaschenbuch. Condition: Neu. Neuware -This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 244 pp. Englisch.
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Published by Berlin Springer International Publishing Springer Aug 2020, 2020
ISBN 10: 3030234274 ISBN 13: 9783030234270
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Add to basketTaschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems. 281 pp. Englisch.
Published by Springer International Publishing Jun 2019, 2019
ISBN 10: 303023424X ISBN 13: 9783030234249
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Add to basketBuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems. 300 pp. Englisch.
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Add to basketCondition: New. Print on Demand pp. 281.