He Feifei (11 results)

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: As New. Unread book in perfect condition.

Hardcover. Condition: Fine. Dust Jacket Condition: Fine. reprint. Very clean bright boards no bumps or rubs. Textblocks in red, Book plate with author signature to FEP unopened. Fine.   Dust Wrapper Complete no loss tears or rubs as new. Jacket Illustration by Feifei Ruan Design and Interior Illustrations by Ellen Kokontis (illustrator). Signed by Author(s).…

Condition: New. pp. 116.

Paperback. Condition: Brand New. 2013 edition. 112 pages. 9.37x6.14x0.39 inches. In Stock.

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. 116 pp. Englisch.…

Condition: New. Print on Demand pp. 116 75 Illus. (2 Col.).

Condition: New. PRINT ON DEMAND pp. 116.

Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Highlights a new method which models the interconnects EM reliability in both 3D and circuit layout level Combines Cadence and ANSYS softwares to model interconnect reliability of real 3D circuit made up of complete interconnect structures and surro.…