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Peter a Sandborn (66 results)
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Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Cost Analysis of Electronic Systems
Book 1 of 7: WSPC Series in Advanced Integration and PackagingLanguage: English
Published by World Scientific Pub Co Inc, 2012
ISBN 10: 9814383341 ISBN 13: 9789814383349
Condition: Bueno. : Este libro analiza los costes de los sistemas electrónicos, abarcando desde la ingeniería de producción hasta la economía de la ingeniería. Publicado en 2012, el libro tiene 300 páginas y está escrito en inglés. Es una guía para entender los aspectos económicos de los sistemas electrónicos. EAN: 9789814383349 Tipo: Libros Categoría: Tecnología|Negocios y Economía Título: Cost Analysis of Electronic Systems Autor: Peter A. Sandborn Idioma: en Páginas: 300.
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Corrosion Processes. Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies.
Book 13 of 18: Structural IntegritySeller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
VII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Structural Integrity, 13. Sprache: Englisch.
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Condition: New. Diego Galar has a Msc in Telecommunications and a PhD degree in Manufacturing from the University of Saragossa. He has become Professor in several universities, including the University of Saragossa or the European University of Madrid. .
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies (Structural Integrity)
Book 13 of 18: Structural IntegritySeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 133.25
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Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies: 13 (Structural Integrity, 13)
Book 13 of 18: Structural IntegrityUS$ 130.49
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Add to basketPaperback. Condition: New.
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Condition: As New. Unread book in perfect condition.
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Condition: New. 1st ed. 2020 edition NO-PA16APR2015-KAP.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies (Structural Integrity, 13)
Book 13 of 18: Structural IntegritySeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 175.50
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Conceptual Design of Multichip Modules and Systems (The Springer International Series in Engineering and Computer Science, 250)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 189.59
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Taschenbuch. Condition: Neu. Corrosion Processes | Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies | George Vachtsevanos (u. a.) | Taschenbuch | Structural Integrity | vii | Englisch | 2021 | Springer | EAN 9783030328337 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Conceptual Design of Multichip Modules and Systems (The Springer International Series in Engineering and Computer Science)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 189.59
US$ 16.00 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Conceptual Design of Multichip Modules and Systems
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 189.56
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/protection, Diagnosis/Prognosis and Maintenance Strategies
Book 13 of 18: Structural IntegrityUS$ 193.40
US$ 16.69 shipping
Ships from United Kingdom to U.S.A.Quantity: 2 available
Add to basketPaperback. Condition: Brand New. 348 pages. 9.25x6.10x0.91 inches. In Stock.
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Condition: New.
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Corrosion Processes : Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies
Book 13 of 18: Structural IntegrityLanguage: English
Published by Springer International Publishing, 2021
ISBN 10: 3030328333 ISBN 13: 9783030328337
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
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Condition: Hervorragend. Zustand: Hervorragend | Seiten: 280 | Sprache: Englisch | Produktart: Bücher | Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
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Condition: As New. Unread book in perfect condition.
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Condition: As New. Unread book in perfect condition.
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Condition: Hervorragend. Zustand: Hervorragend | Seiten: 348 | Sprache: Englisch | Produktart: Bücher | This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
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Condition: As New. Unread book in perfect condition.
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Taschenbuch. Condition: Neu. Conceptual Design of Multichip Modules and Systems | Peter A. Sandborn (u. a.) | Taschenbuch | xvi | Englisch | 2010 | Springer | EAN 9781441951373 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: New. pp. 276.
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Condition: New. pp. 280.
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Integrated Product and Process Design and Development : The Product Realization Process
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 241.71
US$ 20.03 shipping
Ships from United Kingdom to U.S.A.Quantity: 15 available
Add to basketCondition: As New. Unread book in perfect condition.
