Sandborn Peter A (62 results)
- Hardcover
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.ThriftBooks-Dallas
Contact seller5-star sellerCondition: Used - Good
US$ 43.97
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Language: English
Published by Cham, Springer., 2020
- Hardcover
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, GermanyUniversitätsbuchhandlung Herta Hold GmbH
Contact seller4-star sellerCondition: Used
US$ 23.46
US$ 34.16 shippingShips from Germany to U.S.A.Quantity: 1 available
VII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Structural Integrity, 13. Sprache: Englisch.
Language: English
Published by World Scientific Pub Co Inc, 2012
Series: Book 1 of 7 - WSPC Series in Advanced Integration and Packaging
- Hardcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
Contact seller5-star sellerCondition: Used - Very good
US$ 60.21
US$ 14.79 shippingShips from Spain to U.S.A.Quantity: 1 available
Condition: Bueno. : Este libro analiza los costes de los sistemas electrónicos, abarcando desde la ingeniería de producción hasta la economía de la ingeniería. Publicado en 2012, el libro tiene 300 páginas y está escrito en inglés. Es una guía para entender los aspectos económicos de los sistemas electrónicos. EAN: 9789814383349… Tipo: Libros Categoría: Tecnología|Negocios y Economía Título: Cost Analysis of Electronic Systems Autor: Peter A. Sandborn Idioma: en Páginas: 300.
- More images
- Softcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 87.66
US$ 55.78 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Einband - flex.(Paperback). Condition: New. Diego Galar has a Msc in Telecommunications and a PhD degree in Manufacturing from the University of Saragossa. He has become Professor in several universities, including the University of Saragossa or the European University of Madrid. .
Language: English
Published by Springer, 2021
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 132.58
US$ 15.92 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies: 13 (Structural Integrity, 13)
George Vachtsevanos, K. A. Natarajan, Ravi Rajamani, Peter Sandborn
Language: English
Published by Springer 2021-01-02, 2021
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
Contact seller5-star sellerCondition: New
US$ 129.83
US$ 20.58 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Paperback. Condition: New.
Language: English
Published by Springer, 2021
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 176.32
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. 1st ed. 2020 edition NO-PA16APR2015-KAP.
Language: English
Published by Springer, 2020
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 174.62
US$ 15.92 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 188.64
US$ 15.92 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- More images
Language: English
Published by Springer, 2021
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 122.21
US$ 79.70 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Corrosion Processes | Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies | George Vachtsevanos (u. a.) | Taschenbuch | Structural Integrity | vii | Englisch | 2021 | Springer | EAN 9783030328337 | Verantwortliche Person für die EU: Springer Verl…ag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 188.64
US$ 15.92 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- More images
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 199.35
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 202.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 188.61
US$ 19.93 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by Springer Nature, 2021
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 193.36
US$ 16.61 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. 348 pages. 9.25x6.10x0.91 inches. In Stock.
- More images
Language: English
Published by Springer International Publishing, 2021
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 138.02
US$ 71.32 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and… return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
Language: English
Published by Springer, 2021
- Softcover
Seller: Buchpark, Trebbin, GermanyBuchpark
Contact seller5-star sellerCondition: Used
US$ 104.39
US$ 119.55 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Hervorragend. Zustand: Hervorragend | Seiten: 348 | Sprache: Englisch | Produktart: Bücher | This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to mai…ntenance practices and return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
- More images
Integrated Product and Process Design and Development : The Product Realization Process
Magrab, Edward B.; Gupta, Satyandra K.; McCluskey, F. Patrick; Sandborn, Peter A.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 234.41
US$ 2.64 shippingShips within U.S.A.Quantity: 1 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 235.53
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 276.
- More images
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 164.30
US$ 79.70 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Conceptual Design of Multichip Modules and Systems | Peter A. Sandborn (u. a.) | Taschenbuch | xvi | Englisch | 2010 | Springer | EAN 9781441951373 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: prei…gu.
Language: English
Published by Springer, 2020
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 235.99
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 237.90
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 280.
- More images
Integrated Product and Process Design and Development : The Product Realization Process
Magrab, Edward B.; Gupta, Satyandra K.; McCluskey, F. Patrick; Sandborn, Peter A.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 240.51
US$ 19.93 shippingShips from United Kingdom to U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
- More images
Language: English
Published by Springer International Publishing, 2020
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 188.21
US$ 72.23 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and return… on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
- More images
Integrated Product and Process Design and Development : The Product Realization Process
Magrab, Edward B.; Gupta, Satyandra K.; McCluskey, F. Patrick; Sandborn, Peter A.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 256.19
US$ 2.64 shippingShips within U.S.A.Quantity: 1 available
Condition: New.
- More images
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 197.88
US$ 71.66 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modelin…g), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
- More images
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 197.88
US$ 72.24 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information…modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
- More images
Integrated Product and Process Design and Development : The Product Realization Process
Magrab, Edward B.; Gupta, Satyandra K.; McCluskey, F. Patrick; Sandborn, Peter A.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 269.99
US$ 19.93 shippingShips from United Kingdom to U.S.A.Quantity: 15 available
Condition: New.
Language: English
Published by Springer Verlag, 2020
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 273.56
US$ 16.61 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 339 pages. 9.25x6.25x1.00 inches. In Stock.
Language: English
Published by Springer, 2020
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: New
US$ 294.23
US$ 33.22 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
