Defect Recognition Image Processing by Doneker (9 results)
- Hardcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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- Hardcover
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Condition: New. pp. 548.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. pp. 548.
- Hardcover
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Doneker, J.Defect Recognition and Image Processing in Semiconductors 1997 provides a valuable overview of current techniques used to assess, monitor, and characterize defects from the atomic scale to inhomog…eneities in complete silicon wafers. This .
- Hardcover
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Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New. pp. 548 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam This item is printed on demand.
- Hardcover
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Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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HRD. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Hardcover
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Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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HRD. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Hardcover
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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Defect Recognition and Image Processing in Semiconductors 1997 provides a valuable overview of current techniques used to assess, monitor, and characterize defects from the atomic scale to inhomogeneities in complete silicon wafers. This volume… addresses advances in defect analyzing techniques and instrumentation and their application to substrates, epilayers, and devices. The book discusses the merits and limits of characterization techniques; standardization; correlations between defects and device performance, including degradation and failure analysis; and the adaptation and application of standard characterization techniques to new materials. It also examines the impressive advances made possible by the increase in the number of nanoscale scanning techniques now available. The book investigates defects in layers and devices, and examines the problems that have arisen in characterizing gallium nitride and silicon carbide.
