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Proceedings of the Third Japan International SAMPE Symposium, Volume 1: "Advanced Materials", New Processes and Reliability
Language: English
Published by Society for the Advancement of Material and Process Engineering, 1993
ISBN 10: 4990002830 ISBN 13: 9784990002831
Hardcover. Condition: Good. No marks, light cover wear.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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Proceedings of the Third Japan International SAMPE Symposium, Volume 1: "Advanced Materials", New Processes and Reliability
Language: English
Published by Society for the Advancement of Material and Process Engineering, Japan, 1993
ISBN 10: 4990002830 ISBN 13: 9784990002831
Seller: PsychoBabel & Skoob Books, Didcot, United Kingdom
Seller rating 5 out of 5 stars
First Edition
US$ 30.95
US$ 16.85 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to baskethardcover. Condition: Very Good. Dust Jacket Condition: No Dust Jacket. First Edition. Small black mark at the bottom page corner. Used.
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Progress in Advanced Materials and Processes : Durability, Reliability and Quality Control, Proceedings.
Language: English
Published by Elsevier, Amsterdam / Oxford / New York / Tokyo:, 1985
ISBN 10: 0444424997 ISBN 13: 9780444424990
First Edition
Hardcover. Condition: Original blue boards. Dust Jacket Condition: No Dust Jacket. First Edition. Amsterdam / Oxford / New York / Tokyo:: Elsevier, 1985. Very Good condition. Clean, square, and tight. EX-LIBRARY copy, stamped "WITHDRAWN" on endpapers. No underlining. No margin notes. No highlighting. Illustrated throughout with diagrams, drawings, tables, and photographs. Bibliographical references. Index. Proceedings of the 6th International European Chapter Conference of the Society for the Advancement of Material and Process Engineering, Scheveningen, The Netherlands, May 28- 30, 1985. Volume 29 in the Materials Science Monographs series. First Edition. Hardcover. Original blue boards/No Dust Jacket. 8vo. x, 309pp.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 41.65
US$ 16.15 shipping
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Add to basketCondition: New. In.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10-12, ... California, U.S.A. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 41.65
US$ 16.15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
US$ 40.14
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Add to basketPaperback. Condition: New.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics: Volume 990: Symposium Held April 10 12, 20
Language: English
Published by Cambridge University Press 2014-05, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
US$ 40.27
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Materials, Processes, and Reliability for Advanced Interconnects
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. pp. ix + 127.
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Progress in advanced materials and processes. durability, reliability and quality control.
Seller: Emile Kerssemakers ILAB, Heerlen, Netherlands
Seller rating 5 out of 5 stars
25 cm. original hardcover. x,310 pp. ills, diagrams, tables. references. index. "Materials science monographs, 29". -(libr label, library stamp, slightly rubbed, owner's name, otherwise (very) good). 777g.
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Materials, Processes, and Reliability for Advanced Interconnects
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. pp. ix + 127 Illus.
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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Materials, Processes, and Reliability for Advanced Interconnects
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. pp. ix + 127.
-
MATERIALS, PROCESSES AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS - 2009: VOLUME 1156
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009 : Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics : Volume 990: Symposium Held April 10 12, 20
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 142.50
US$ 16.15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Progress in Advanced Materials and Processes: Durability, Reliability and Quality Control - International Conference Proceedings (Materials Science Monographs)
Language: English
Published by Elsevier Science Ltd, 1985
ISBN 10: 0444424997 ISBN 13: 9780444424990
Condition: Gut. Zustand: Gut | Seiten: 320 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335 (MRS Proceedings)
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
US$ 131.91
US$ 33.70 shipping
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Add to basketHardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
US$ 163.84
US$ 33.70 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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US$ 190.23
US$ 13.48 shipping
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Add to basketHardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock.
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Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990 (Paperback)
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
Paperback. Condition: new. Paperback. In 2004, the microelectronics industry quietly ushered in the Nanoelectronics Era with the mass production of sub-100nm node devices. The current leading-edge semiconductor chips in mass production - the so-called 90nm node devices - have a transistor gate length of less than 50nm. This rapid technological advancement in the semiconductor industry has been made possible by innovations in materials employed in both transistor fabrication (front-end-of-the-line, FEOL) and interconnect fabrication (back-end-of-the-line, BEOL). The 90nm node BEOL features copper (Cu) interconnects and dielectric materials with a low-dielectric constant (k) of about 3.0. However, for the next generations of 65nm node and beyond, evolutionary and revolutionary innovations in BEOL materials and processes are needed to fuel the continued, healthy growth of the semiconductor. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Volume 1156 (Paperback)
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.S.A.: Volume 990
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408717 ISBN 13: 9781107408715
US$ 40.59
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Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback. Condition: Brand New. 1st edition. 358 pages. 9.02x5.98x0.75 inches. In Stock. This item is printed on demand.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics â" 2009: Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
US$ 40.59
US$ 13.48 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback. Condition: Brand New. 1st edition. 204 pages. 9.02x5.98x0.43 inches. In Stock. This item is printed on demand.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 46.09
US$ 18.27 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
