Order Total (1 Item Items):
Shipping Destination:
Microelectronics Packaging Handbook by R R Tummala (87 results)
Feedback
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (87)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
- New (60)
- As New, Fine or Near Fine (5)
- Very Good or Good (21)
- Fair or Poor (1)
- As Described (No further results match this refinement)
Binding
Collectible Attributes
- First Edition (1)
- Signed (No further results match this refinement)
- Dust Jacket (2)
- Seller-Supplied Images (22)
- Not Print on Demand (82)
Language (2)
Free Shipping
Seller Location
Seller Rating
-
Hardcover. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority!
-
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
-
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9.
-
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9.
-
Hardcover. Condition: Good. No Jacket. Missing dust jacket; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9.
-
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9.
-
Microelectronics Packaging Handbook
Seller: Wonder Book, Frederick, MD, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Good condition. Good dust jacket. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains. NOT AVAILABLE FOR SHIPMENT OUTSIDE OF THE UNITED STATES.
-
Microelectronics Packaging Handbook
Seller: A Squared Books (Don Dewhirst), South Lyon, MI, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book.
-
hardcover. Condition: Very Good. 2nd. Used - Very Good.
-
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 2.6.
-
Microelectronics Packaging Handbook: Technology Drivers Part I
Published by Springer (edition 2nd), 1997
ISBN 10: 0412084317 ISBN 13: 9780412084317
Language: English
Hardcover. Condition: Good. 2nd. It's a preowned item in good condition and includes all the pages. It may have some general signs of wear and tear, such as markings, highlighting, slight damage to the cover, minimal wear to the binding, etc., but they will not affect the overall reading experience.
-
Microelectronics Packaging Handbook
Published by Kluwer Academic Publishers, 1988
ISBN 10: 0442205783 ISBN 13: 9780442205782
Language: English
US$ 24.50
Convert currencyUS$ 16.86 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to the page edges/pages . Previous owners name inside the front page/cover.
-
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
-
US$ 38.42
Convert currencyUS$ 17.44 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515.
-
US$ 38.87
Convert currencyUS$ 17.44 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. Volume 3. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:9780412084515.
-
Microelectronics Packaging HandBook
Published by Van Nostrand Reinhold, New York NY, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Language: English
First Edition
Hardcover. Condition: Near Fine. 1st Edition. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. This copy is in excellent condition, a second printing of the first edition, a hardback with no dustjacket . Given the book's size and weight--3# 13oz-- shipping charges will be adjusted.The book will be carefully wrapped and boxed for safe shipping.
-
US$ 38.90
Convert currencyUS$ 20.22 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Good. Volume 2. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1650grams, ISBN:9780412084416.
-
Microelectronics Packaging Handbook
Published by Van Nostrand Reinhold, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Language: English
Hardcover. Condition: UsedVeryGood. Hardcover; light fading, light shelf wear to exterior; otherwise in very good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear.
-
Condition: acceptable. A readable copy. All pages are intact, and the cover is intact. Dust jacket may be missing. Pages can include considerable highlighting markings writing but cannot obscure the text. May be an Ex-lib. copy and have standard library stamps and or stickers. May NOT include discs, or access code or other supplemental material. We ship Monday-Saturday and respond to inquiries within 24 hours.
-
Condition: New. pp. 1000 2nd Edition.
-
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
-
US$ 58.75
Convert currencyUS$ 8.76 shipping from United Kingdom to U.S.A.Quantity: 4 available
Add to basketCondition: New. pp. 1000.
-
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Published by Chapman & Hall, New York, 1997
ISBN 10: 0412084414 ISBN 13: 9780412084416
Language: English
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
-
US$ 65.51
Convert currencyUS$ 11.67 shipping from Germany to U.S.A.Quantity: 4 available
Add to basketCondition: New. pp. 1000.
-
hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
-
Hardcover. Condition: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
-
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Published by Springer-Verlag Publishing, 1997
ISBN 10: 0412084414 ISBN 13: 9780412084416
Language: English
Condition: Good. 2. Good+; Hardcover; Former corporate library copy with company stamp to the right textblock edge, inside each cover, and to the first and last endpapers; Covers are clean and glossy; Text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Purple and orange covers with title in white and yellow lettering; 2nd Edition; 1997, Springer-Verlag Publishing; 1030 pages; "Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging," by R.R. Tummala, et al.
-
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
-
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
-
hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
