Eugene J Rymaszewski (56 results)
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: -OnTimeBooks-, Phoenix, AZ, U.S.A.-OnTimeBooks-
Contact seller5-star sellerCondition: Used - Very good
US$ 15.15
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Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships USPS Media Mail.…
- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
US$ 12.21
US$ 3.75 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.Goodwill of Silicon Valley
Contact seller4-star sellerCondition: Used - Good
US$ 17.13
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.
- Hardcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
Contact seller5-star sellerCondition: Used - Very good
US$ 35.81
US$ 15.07 shippingShips from Spain to U.S.A.Quantity: 1 available
Condition: Very Good. : Este exhaustivo manual de tres volúmenes, revisado y actualizado, sigue siendo la referencia estándar en el campo de la microelectrónica. Ofrece lo último en métodos de diseño, herramientas de modelado, técnicas de simulación y procedimientos de fabricación. A diferencia de otros libros que se centran solo en algunos aspectos del embalaje de microelectrónica, esta obra analiza los paquetes de última generación que cumplen con los requisitos de potencia, refrigeración, protección e interconexión de circuitos cada vez más densos y rápidos. Con un excelente equilibrio entre teoría y aplicaciones prácticas, esta dinámica recopilación presenta ejemplos paso a paso y datos técnicos vitales, simplificando cada fase del diseño y la producción de paquetes. Además, los volúmenes contienen más de 2000 referencias, 900 figuras y 250 tablas. EAN: 9780412084515 Tipo: Libros Categoría: Tecnología Título: Microelectronics Packaging Handbook Autor: Rao Tummala| Eugene J. Rymaszewski| Alan G. Klopfenstein Idioma: en Páginas: 662 Formato: Tapa dura.…
- Hardcover
Seller: BookDepart, Shepherdstown, WV, U.S.A.BookDepart
Contact seller5-star sellerCondition: Used - Very good
US$ 51.02
US$ 8.44 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: UsedVeryGood. Hardback with dust jacket. Light shelf wear to exterior; discard stamp on e xterior bottom page edge; former owner's name blacked out at top of exterio r page edge; former owner's name written on front end page; otherwise in ve ry good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear. …
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Cornerstone Books, Villa Park, IL, U.S.A.Cornerstone Books
Contact seller4-star sellerCondition: Used - Very good
US$ 60.73
US$ 4.50 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Very Good. 2nd. Minimal wear.
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (ed)
- Hardcover
Seller: Moe's Books, Berkeley, CA, U.S.A.Moe's Books
Contact seller4-star sellerCondition: Used - Good
US$ 100.00
US$ 6.50 shippingShips within U.S.A.Quantity: 1 available
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 129.35
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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US$ 132.00
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Condition: New.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 134.88
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
US$ 137.48
US$ 6.95 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 134.98
US$ 15.27 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 134.98
US$ 15.27 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 134.97
US$ 20.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: DeckleEdge LLC, Albuquerque, NM, U.S.A.DeckleEdge LLC
Contact seller5-star sellerCondition: New
US$ 153.21
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hardcover. Condition: new.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
US$ 146.50
US$ 6.95 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 145.89
US$ 20.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 160.88
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 180.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 199.35
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 202.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 192.05
US$ 15.27 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 191.15
US$ 20.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 251.74
US$ 20.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 216.21
US$ 56.83 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 257.73
US$ 20.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 263.37
US$ 15.27 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 263.37
US$ 15.27 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 269.31
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook: Subsystem Packaging Part III (Pt. 1)
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 246.60
US$ 33.82 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 277.77
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
