Rymaszewski Eugene J (66 results)
- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
US$ 14.16
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
Microelectronics Packaging Handbook Pt. III : Subsystem Packaging
Klopfenstein, Alan G., Rymaszewski, Eugene J., Tummala, Rao R.
- Hardcover
Seller: Better World Books: West, Reno, NV, U.S.A.Better World Books: West
Contact seller5-star sellerCondition: Used - Good
US$ 21.10
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Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.Goodwill of Silicon Valley
Contact seller5-star sellerCondition: Used - Good
US$ 18.04
US$ 3.99 shippingShips within U.S.A.Quantity: 1 available
Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.
- Hardcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
Contact seller5-star sellerCondition: Used - Near fine
US$ 36.98
US$ 14.95 shippingShips from Spain to U.S.A.Quantity: 1 available
Condition: Muy bueno. : Este exhaustivo manual de tres volúmenes, revisado y actualizado, sigue siendo la referencia estándar en el campo de la microelectrónica. Ofrece lo último en métodos de diseño, herramientas de modelado, técnicas de simulación y procedimientos de fabricación. A diferencia de otros libros que se centran sol…o en algunos aspectos del embalaje de microelectrónica, esta obra analiza los paquetes de última generación que cumplen con los requisitos de potencia, refrigeración, protección e interconexión de circuitos cada vez más densos y rápidos. Con un excelente equilibrio entre teoría y aplicaciones prácticas, esta dinámica recopilación presenta ejemplos paso a paso y datos técnicos vitales, simplificando cada fase del diseño y la producción de paquetes. Además, los volúmenes contienen más de 2000 referencias, 900 figuras y 250 tablas. EAN: 9780412084515 Tipo: Libros Categoría: Tecnología Título: Microelectronics Packaging Handbook Autor: Rao Tummala| Eugene J. Rymaszewski| Alan G. Klopfenstein Idioma: en Páginas: 662.
Microelectronics Packaging Handbook: Semiconductor Packaging
Tummala, R. R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Softcover
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.ThriftBooks-Dallas
Contact seller5-star sellerCondition: Used - Good
US$ 56.19
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Paperback. Condition: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
- Hardcover
Seller: BookDepart, Shepherdstown, WV, U.S.A.BookDepart
Contact seller5-star sellerCondition: Used - Very good
US$ 51.02
US$ 8.44 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: UsedVeryGood. Hardback with dust jacket. Light shelf wear to exterior; discard stamp on e xterior bottom page edge; former owner's name blacked out at top of exterio r page edge; former owner's name written on front end page; otherwise in ve ry good condition with clean text, firm binding. Dust jacket, ligh…t fading, light shelf wear.
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Cornerstone Books, Villa Park, IL, U.S.A.Cornerstone Books
Contact seller5-star sellerCondition: Used - Very good
US$ 64.62
US$ 4.50 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Very Good. 2nd. Minimal wear.
- Hardcover
Seller: Books From California, Simi Valley, CA, U.S.A.Books From California
Contact seller4-star sellerCondition: Used - Very good
US$ 72.90
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Hardcover. Condition: Very Good. The copy shows minor external wear, but is in otherwise clean condition.
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (ed)
- Hardcover
Seller: Moe's Books, Berkeley, CA, U.S.A.Moe's Books
Contact seller4-star sellerCondition: Used - Good
US$ 100.00
US$ 6.50 shippingShips within U.S.A.Quantity: 1 available
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 129.35
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Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 132.00
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Condition: New.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 134.88
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 133.99
US$ 16.09 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
US$ 137.43
US$ 6.95 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 133.99
US$ 16.09 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: DeckleEdge LLC, Albuquerque, NM, U.S.A.DeckleEdge LLC
Contact seller5-star sellerCondition: New
US$ 146.45
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hardcover. Condition: new.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 133.98
US$ 20.14 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
US$ 146.45
US$ 6.95 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 145.77
US$ 20.14 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 160.88
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 180.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 133.66
US$ 70.68 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials propert…ies to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 133.66
US$ 71.59 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to…limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 190.64
US$ 16.09 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 199.35
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 202.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 190.37
US$ 20.14 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 249.04
US$ 20.14 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 214.49
US$ 56.37 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 255.84
US$ 20.14 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 261.44
US$ 16.09 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
