Failure Analysis Integrated Circuits (31 results)
Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
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Hardcover. Condition: Very Good. This book is in very good condition; no remainder marks. It does have some cover shelfwear. Some scraping inside front cover from removal of a stubborn book plate. Inside pages are clean. ; The Springer International Series In Engineering And Computer Science, 494; 268 pages.
Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
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Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
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hardcover. Condition: Gut. 268 Seiten; 9780412145612.3 Gewicht in Gramm: 1.
Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
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Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
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Condition: New. pp. 272.
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Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Taschenbuch. Condition: Neu. Failure Analysis of Integrated Circuits | Tools and Techniques | Lawrence C. Wagner | Taschenbuch | The Springer International Series in Engineering and Computer Science | xiii | Englisch | 2012 | Springer | EAN 9781461372318 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 1…7, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
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Condition: New. pp. 276.
Language: English
Published by Chapman and Hall 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
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Condition: New. Provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. This book also includes the coverage of the shortcomings, limitations, and strengths of each technique. Edito…r(s): Wagner, Lawrence C. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 255 pages, biography. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 565. . 1999. 1999th Edition. hardcover. . . . .
Language: English
Published by Springer, Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in in…tegrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
Language: English
Published by Springer, Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrate…d circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Chapman and Hall 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
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Condition: New. Provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. This book also includes the coverage of the shortcomings, limitations, and strengths of each technique. Edito…r(s): Wagner, Lawrence C. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 255 pages, biography. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 565. . 1999. 1999th Edition. hardcover. . . . . Books ship from the US and Ireland.
Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Language: English
Published by Springer 2012
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Language: English
Published by Springer US Nov 2012 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root…cause of electrical failures in integrated circuits. 272 pp. Englisch.
Language: English
Published by Springer US Jan 1999 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
- Print on Demand
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause o…f electrical failures in integrated circuits. 276 pp. Englisch.
Language: English
Published by Springer US 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understand…ing the root cause of electrical fa.
Language: English
Published by Springer US 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
- Print on Demand
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understand…ing the root cause of electrical fa.
Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
- Print on Demand
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Buch. Condition: Neu. Failure Analysis of Integrated Circuits | Tools and Techniques | Lawrence C. Wagner | Buch | The Springer International Series in Engineering and Computer Science | xiii | Englisch | 1999 | Springer | EAN 9780412145612 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heide…lberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
- Print on Demand
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Condition: New. Print on Demand pp. 272 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Language: English
Published by Springer 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
- Print on Demand
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Condition: New. Print on Demand pp. 276 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Language: English
Published by Springer, Springer Jan 1999 1999
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Hardcover
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Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures…in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 276 pp. Englisch.
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Published by Springer, Springer Nov 2012 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical fa…ilures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 272 pp. Englisch.
Language: English
Published by Springer 2012
Series: The Springer International Series in Engineering and Computer Science, Book 195 of 260. Book 195 of 260 - The Springer International Series in Engineering and Computer Science
- Softcover
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Condition: New. PRINT ON DEMAND pp. 272.
