Franzon Paul (29 results)
- Softcover
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.World of Books (was SecondSale)
Contact seller5-star sellerCondition: Used - As new
US$ 10.44
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Like New. Item in very good condition! Textbooks may not include supplemental items i.e. CDs, access codes etc.
- Softcover
Seller: Better World Books: West, Reno, NV, U.S.A.Better World Books: West
Contact seller5-star sellerCondition: Used - Very good
US$ 12.51
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
- Softcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
US$ 12.89
US$ 3.75 shippingShips within U.S.A.Quantity: 1 available
Paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
- Hardcover
- First Edition
Seller: Reader's Corner, Inc., Raleigh, NC, U.S.A.Reader's Corner, Inc.
Contact seller5-star sellerCondition: Used - As new
US$ 39.50
US$ 5.50 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: As New. No Jacket. 1st Edition. This is a fine, as new, hardcover first edition copy, no DJ, blue spine. 875 pages with index. Photos on request.
- Softcover
Seller: MatSamstore, chantilly, VA, U.S.A.MatSamstore
Contact seller4-star sellerCondition: New
US$ 51.30
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New.
- Hardcover
- First Edition
Seller: Reader's Corner, Inc., Raleigh, NC, U.S.A.Reader's Corner, Inc.
Contact seller5-star sellerCondition: Used - Fine
US$ 55.00
US$ 5.50 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Fine. No Jacket. 1st Edition. This is a fine hardcover first edition, first printing copy, no DJ, white/black spine, 314 pages with index.
- Hardcover
- First Edition
Seller: Bibliomadness, Worthington, MA, U.S.A.Bibliomadness
Contact seller5-star sellerCondition: Used - Good
US$ 85.00
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Good. 1st Edition. Note older edition, copyright 2001. Good condition. Some edgewear. Used and bookstore stickers on spine and rear cover. A handful of pages with some pencil markings. All intact. Good reading or reference copy.
- Hardcover
Seller: La bataille des livres, Pradinas, FranceLa bataille des livres
Contact seller5-star sellerCondition: Used - Fine
US$ 16.46
US$ 75.49 shippingShips from France to U.S.A.Quantity: 1 available
Condition: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au…dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.
- Softcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
US$ 101.09
US$ 3.75 shippingShips within U.S.A.Quantity: 1 available
paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
- Softcover
Seller: ICTBooks, Wichita, KS, U.S.A.ICTBooks
Contact seller5-star sellerCondition: Used - Good
US$ 105.11
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: good. Book shows wear from use but remains a usable copy. May include writing highlighting underlining library markings. LISTING USES STOCK PHOTOS AND COVER MAY VARY. Ships via USPS and typically arrives within 10-12 business days.
- Softcover
Seller: DeckleEdge LLC, Albuquerque, NM, U.S.A.DeckleEdge LLC
Contact seller5-star sellerCondition: New
US$ 110.30
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paperback. Condition: new.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 98.26
US$ 16.90 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Brand New. 1st edition. 314 pages. 9.25x7.00x0.75 inches. In Stock.
- Softcover
Seller: GoldBooks, Denver, CO, U.S.A.GoldBooks
Contact seller5-star sellerCondition: New
US$ 106.98
US$ 5.50 shippingShips within U.S.A.Quantity: 1 available
Paperback. Condition: new. New Copy. Customer Service Guaranteed.
Language: English
Published by World Scientific Publishing Co Pte Ltd, Singapore, 1996
- Hardcover
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
Contact seller5-star sellerCondition: New
US$ 125.03
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and… other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Hardcover
Seller: Russell Books, Victoria, BC, CanadaRussell Books
Contact seller5-star sellerCondition: New
US$ 105.06
US$ 19.99 shippingShips from Canada to U.S.A.Quantity: 1 available
hardcover. Condition: New. Special order direct from the distributor.
- Softcover
Seller: SHIMEDIA, Brooklyn, NY, U.S.A.SHIMEDIA
Contact seller4-star sellerCondition: New
US$ 149.99
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: New. Satisfaction Guaranteed or your money back.
EDA for IC Implementation, Circuit Design, and Process Technology (Electronic Design Automation for Integrated Circuits Hdbk)
Scheffer, Louis [Editor]; Lavagno, Luciano [Editor]; Martin, Grant [Editor]; Martin, Grant [Editor]; Franzon, Paul D. [Contributor]; Schellenberg, Franklin [Contributor]; Khatri, Sunil P. [Contributor]; Hogan, James H. [Contributor]; Hutton, Michael D. [Contributor]; Bales, Mark [Contributor]; Dutton, Robert W. [Contributor]; Kariat, Vinod [Contributor]; Mo, Fan [Contributor]; Verghese, Nishath [Contributor]; Johnson, Mark Donald [Contributor]; Monteiro, Jose C. [Contributor]; Rutenbar, Rob A. [Contributor]; Blaauw, David T. [Contributor]; Todd, Robert A. [Contributor]; Stok, Leon [Contributor]; Roychowdhury, Jaijeet [Contributor]; Iverson, Ralph B. [Contributor]; Kahng, Andrew B. [Contributor]; Kuehlmann, Andreas [Contributor]; Kao, William H. [Contributor]; Cohn, John Maxwell [Contributor]; Gielen, Georges G.E. [Contributor]; Dragone, Nicola [Contributor]; Tiwari, Vivek [Contributor]; Shenoy, Narendra [Contributor]; Betz, Vaughn [Contributor]; Hathaway, David J. [Contributor]; Kan, E
Language: English
Published by CRC Press, 2006
Series: Book 1 of 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Hardcover
Seller: Swan Trading Company, GEORGETOWN, TX, U.S.A.Swan Trading Company
Contact seller5-star sellerCondition: Used - Good
US$ 179.98
Free ShippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Hardcover ex-library with typical marks shows moderate cover wear. Text is unmarked. Ships FAST.
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 169.67
US$ 16.90 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Brand New. 254 pages. 10.25x7.00x0.75 inches. In Stock.
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 130.96
US$ 56.90 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti.
- Softcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
US$ 191.51
US$ 6.95 shippingShips within U.S.A.Quantity: 1 available
paperback. Condition: New. In shrink wrap. Looks like an interesting title.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 176.81
US$ 33.79 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. Like NewLIKE NEW. book.
Language: English
Published by World Scientific Publishing Co Pte Ltd, Singapore, 1996
- Hardcover
Seller: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contact seller5-star sellerCondition: New
US$ 211.03
US$ 37.00 shippingShips from Australia to U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and… other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
US$ 240.11
US$ 10.50 shippingShips within U.S.A.Quantity: 10 available
Condition: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon…, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Books ship from the US and Ireland.
Language: English
Published by CRC Press 2006-03-23, 2006
Series: Book 1 of 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Hardcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
Contact seller5-star sellerCondition: New
US$ 241.04
US$ 20.94 shippingShips from United Kingdom to U.S.A.Quantity: 5 available
Hardcover. Condition: New.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 263.17
US$ 16.19 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
EDA for IC Implementation, Circuit Design, and Process Technology (Electronic Design Automation for Integrated Circuits Hdbk)
Scheffer, Louis [Editor]; Lavagno, Luciano [Editor]; Martin, Grant [Editor]; Martin, Grant [Editor]; Franzon, Paul D. [Contributor]; Schellenberg, Franklin [Contributor]; Khatri, Sunil P. [Contributor]; Hogan, James H. [Contributor]; Hutton, Michael D. [Contributor]; Bales, Mark [Contributor]; Dutton, Robert W. [Contributor]; Kariat, Vinod [Contributor]; Mo, Fan [Contributor]; Verghese, Nishath [Contributor]; Johnson, Mark Donald [Contributor]; Monteiro, Jose C. [Contributor]; Rutenbar, Rob A. [Contributor]; Blaauw, David T. [Contributor]; Todd, Robert A. [Contributor]; Stok, Leon [Contributor]; Roychowdhury, Jaijeet [Contributor]; Iverson, Ralph B. [Contributor]; Kahng, Andrew B. [Contributor]; Kuehlmann, Andreas [Contributor]; Kao, Willia
Language: English
Published by CRC Press, 2006
Series: Book 1 of 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
US$ 281.21
US$ 6.95 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
US$ 290.72
US$ 11.03 shippingShips from Ireland to U.S.A.Quantity: 10 available
Condition: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon…, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . .
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 297.93
US$ 33.79 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 295.36
US$ 56.90 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.
