Advanced Interconnect Packaging (42 results)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 74.35
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 77.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 63.97
US$ 16.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 80.92
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
More images- Hardcover
Seller: Rarewaves USA, HEBRON, KY, U.S.A.Rarewaves USA
Contact seller5-star sellerCondition: New
US$ 89.12
Free ShippingShips within U.S.A.Quantity: Over 20 available
Hardback. Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 87.58
US$ 16.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 84.59
US$ 20.40 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 91.58
US$ 20.40 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
More images- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
Contact seller5-star sellerCondition: New
US$ 115.40
Free ShippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Hardback. Condition: New.
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
Seller: StainesBook, Weybridge, SURRE, United KingdomStainesBook
Contact seller1-star sellerCondition: New
US$ 98.94
US$ 40.79 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.
More images- Hardcover
Seller: Rarewaves USA United, HEBRON, KY, U.S.A.Rarewaves USA United
Contact seller5-star sellerCondition: New
US$ 94.72
US$ 50.00 shippingShips within U.S.A.Quantity: Over 20 available
Hardback. Condition: New.
More images- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
Contact seller5-star sellerCondition: New
US$ 111.97
US$ 88.38 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Hardback. Condition: New.
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 270.58
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Language: English
Published by Springer International Publishing AG, Cham, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
Contact seller5-star sellerCondition: New
US$ 274.19
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interco…nnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry. This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 279.25
US$ 2.64 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 222.00
US$ 81.58 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Interconnect Reliability in Advanced Memory Device Packaging | Chong Leong Gan (u. a.) | Taschenbuch | Springer Series in Reliability Engineering | xviii | Englisch | 2024 | Springer | EAN 9783031267109 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, ju…ergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 313.76
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. 2023rd edition NO-PA16APR2015-KAP.
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 315.46
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. 2023rd edition NO-PA16APR2015-KAP.
Language: English
Published by Springer International Publishing, 2024
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 256.86
US$ 72.22 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and… technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 256.86
US$ 73.15 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and techni…cal challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Language: English
Published by Springer-Nature New York Inc, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 351.00
US$ 17.00 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 228 pages. 9.25x6.10x0.63 inches. In Stock.
Language: English
Published by Springer Nature B.V., 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
- Print on Demand
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
Contact seller5-star sellerCondition: New
US$ 65.06
Free ShippingShips within U.S.A.Quantity: Over 20 available
PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Language: English
Published by Springer Nature B.V., 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
- Print on Demand
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
US$ 64.64
US$ 5.66 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Hardcover
- Print on Demand
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
Contact seller5-star sellerCondition: New
US$ 88.27
Free ShippingShips within U.S.A.Quantity: Over 20 available
HRD. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Hardcover
- Print on Demand
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
US$ 84.60
US$ 7.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
HRD. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 103.66
US$ 8.84 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand.
- Hardcover
- Print on Demand
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 110.65
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. Print on Demand.
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
US$ 111.74
US$ 11.60 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND.
- Hardcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 108.76
US$ 74.97 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability be…come the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement 'More-than-Moore' technologies, providing heterogeneous materials and technologies on a single chip.The 'Advanced Interconnect and Packaging' Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues.
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 199.60
US$ 7.92 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
